Study on preparation and application of nano-copper powder for power semiconductor device packaging

Pan，Xu1,2; Wang，Ligen7; Qi，Fengcai1,2; Zhou，Youzhi1,2,3; Zhou，Jiacheng1,2,3; Zhang，Jingguo1,2; Zhao，Zhaohui4; Liang，Minghui5; Ye，Huaiyu6; Hu，Qiang1,2; He，Huijun2; Wang，Limin2

10.1109/SSLChinaIFWS49075.2019.9019790

2019-11-01

978-1-7281-5757-3

2019 16th China International Forum on Solid State Lighting and 2019 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2019

54-58

25-27 Nov. 2019

Shenzhen, China

345 E 47TH ST, NEW YORK, NY 10017 USA

IEEE

Nano-copper powder is prepared by liquid phase reduction method in ethylene glycol solvent system. Nano-copper paste is prepared by mixing with organic carriers and subjected to pressureless sintering. The influence of different reducing agent systems on the particle size and morphology of nano-copper powder are studied. The sintering properties of the copper paste are tested by TEM, XRD and SEM. The results indicate that the synthesized product of using ethylene glycol as the reaction solvent and reducing agent is pure copper power and particle size from 100 nm to 200 nm at 160°C; The nano-copper paste can achieve metallurgical bonding at 300°C and the density of the sintered layer gradually increases with the sintering time prolonged, the porosity is gradually reduced, and the sintering of the nano-copper powder for 30 minutes is basically stable.

Nano-copper paste Nano-copper powder The sintering properties

其他

英语

CPCI-S ; EI

Key-Area Research and Development Program of GuangDong Province[2019B010131001]

Electrochemistry ; Engineering

Electrochemistry ; Engineering, Electrical & Electronic

WOS:000559774100015

20201308361749

Ethylene ; Reduction ; Particle size ; Copper powder ; Reducing agents ; Semiconductor devices ; Sintering ; Organic solvents

Copper:544.1 ; Semiconductor Devices and Integrated Circuits:714.2 ; Chemical Reactions:802.2 ; Chemical Agents and Basic Industrial Chemicals:803 ; Organic Compounds:804.1

2-s2.0-85082383210

Scopus

1.Gripm Research Institute Co. Ltd,Beijing,101407,China
2.Gripm Advanced Materials Co. Ltd,Beijing,101407,China
3.General Research Institute for Nonferrous Metals,Beijing,100088,China
4.Beijing Compo Advanced Technology Co.,Ltd,Beijing,101407,China
5.National Center for Nanoscience and Technology,Beijing,100190,China
6.School of Microelectronics,Southern University of Science and Technology,Shenzhen Institute of Wide-bandgap Semiconductors,Shenzhen,518055,China
7.Materials Computation Center,Grimat Engineering Institute Co.,Ltd,Beijing,101407,China

Pan，Xu,Wang，Ligen,Qi，Fengcai,et al. Study on preparation and application of nano-copper powder for power semiconductor device packaging[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2019:54-58.