3D boron nitride foam filled epoxy composites with significantly enhanced thermal conductivity by a facial and scalable approach

Xu，Xinwei1,2,3; Hu，Renchao2,3; Chen，Meiyu2,3; Dong，Jiufeng1,2,3; Xiao，Bin2,3; Wang，Qing4; Wang，Hong2,3

2020-10-01

10.1016/j.cej.2020.125447

CHEMICAL ENGINEERING JOURNAL   影响因子和分区

1385-8947

1873-3212

Polymer composites with excellent thermal conductivity, low dielectric constant and low dielectric loss are urgently required for microelectronics and wireless communication systems. However, traditional thermal conductive polymer composites realized by simply adding inorganic fillers, cannot have high thermal conductivity and good electrical insulation concurrently, which greatly hinders the practical application. In this work, a facile and scalable assembly technique to construct a three-dimensional boron nitride foam (3D-BN) for the formation of 3D-BN/epoxy composites has been proposed to address this long-standing challenge. Herein we built a self-support and pressure reinforced 3D-BN foam composed of only bulk-BN microplates to serve as the thermal pathway. The obtained composite with greatly enhanced thermal conductivity enhancement (TCE) exhibits the highest through-plane thermal conductivity of 6.11 W m K ever reported for bulk-BN polymer composites. Further analysis by finite element simulation revealed that the high thermal conductivity is attributed to the polymer-free, pressure reinforced 3D-BN foam which serves as a more effective pathway for the phonons transmission. This work offers an easy approach and provides a new paradigm for the fabrication and design of thermal management polymers.

Boron nitride Polymer composites Thermal conductivity Three-dimensional networks

SCI ; EI

英语

ESI高被引

通讯

Shenzhen Science and Technology Program[JCYJ20180504165831308][KQTD20180411143514543] ; Shenzhen DRC project[[2018]1433]

Engineering

Engineering, Environmental ; Engineering, Chemical

WOS:000552025300019

ELSEVIER SCIENCE SA

20202108701229

Filled polymers ; Microelectronics ; Reinforcement ; Foams ; Dielectric losses ; III-V semiconductors ; Thermal conductivity ; Boron nitride ; Nitrides

Heat Insulating Materials:413.2 ; Thermodynamics:641.1 ; Dielectric Materials:708.1 ; Semiconducting Materials:712.1 ; Inorganic Compounds:804.2 ; Materials Science:951

ENGINEERING

2-s2.0-85084991388

Scopus

1.School of Microelectronics & State Key Laboratory for Mechanical Behavior of Materials,Xi'an Jiaotong University,Xi'an,710049,China
2.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,China
3.Shenzhen Engineering Research Center for Novel Electronic Information Materials and Devices,Southern University of Science and Technology,Shenzhen,China
4.Materials Science and Engineering,The Pennsylvania State University,University Park,16802,United States

Xu，Xinwei,Hu，Renchao,Chen，Meiyu,et al. 3D boron nitride foam filled epoxy composites with significantly enhanced thermal conductivity by a facial and scalable approach[J]. CHEMICAL ENGINEERING JOURNAL,2020,397.

Xu，Xinwei.,Hu，Renchao.,Chen，Meiyu.,Dong，Jiufeng.,Xiao，Bin.,...&Wang，Hong.(2020).3D boron nitride foam filled epoxy composites with significantly enhanced thermal conductivity by a facial and scalable approach.CHEMICAL ENGINEERING JOURNAL,397.

Xu，Xinwei,et al."3D boron nitride foam filled epoxy composites with significantly enhanced thermal conductivity by a facial and scalable approach".CHEMICAL ENGINEERING JOURNAL 397(2020).