Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering

Yin，Jingfei1; Bai，Qian1; Haitjema，Han2; Zhang，Bi3

2020-10-01

10.1016/j.jmatprotec.2020.116746

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY   影响因子和分区

0924-0136

1097-6787

This study proposes a polarized laser scattering (PLS) method for detection of the two-dimensional distribution of the grinding-induced subsurface damage (SSD). This study also uses two destructive methods to observe the distribution of SSD in the ground silicon wafers by cross-sectional microscopy and by layer-by-layer microscopy. An experimental investigation is arranged for detecting the two-dimensional damage from diamond wheel grinding of silicon wafers through wafer sample preparation and SSD observations with the cross-sectional and layer-by-layer microcopy. It also includes PLS detection of the ground silicon wafers for SSD information. The results show that both the depth of SSD and the crack density contribute to the PLS detection signals. The study reveals the characteristics of the PLS detection, which illustrates the potential application of the PLS method to in-process detection.

Crack Grinding Laser scattering Polarization Silicon wafer

SCI ; EI

英语

通讯

National Natural Science Foundation of China[51575084][51605077] ; Peacock Program of Shenzhen[KQJSCX20180322152221965]

Engineering ; Materials Science

Engineering, Industrial ; Engineering, Manufacturing ; Materials Science, Multidisciplinary

WOS:000538804300005

ELSEVIER SCIENCE SA

20202208759405

Damage detection ; Crack detection ; Raman scattering ; Silicon wafers ; Surface scattering

Machining Operations:604.2 ; Semiconductor Devices and Integrated Circuits:714.2 ; Light/Optics:741.1 ; Classical Physics; Quantum Theory; Relativity:931

MATERIALS SCIENCE

2-s2.0-85085274842

Scopus

1.School of Mechanical Engineering,Dalian University of Technology,Dalian,116024,China
2.Department of Mechanical Engineering,KU Leuven,Leuven,3001,Belgium
3.Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen,518055,China

Yin，Jingfei,Bai，Qian,Haitjema，Han,et al. Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering[J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2020,284.

Yin，Jingfei,Bai，Qian,Haitjema，Han,&Zhang，Bi.(2020).Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering.JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,284.

Yin，Jingfei,et al."Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering".JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 284(2020).