The microstructure and mechanical properties of copper in electrically assisted tension

He，Jing; Zeng，Zhi; Li，Huabing; Wang，Shuai

2020-11-01

10.1016/j.matdes.2020.109171

Materials and Design   影响因子和分区

0264-1275

1873-4197

This study focuses on the mechanical behavior and microstructure evolution of oxygen-free high conductivity copper in the presence of electropulse. The result shows the tensile strength and strain-to-failure decrease linearly with the increase of pulse frequency, and the fracture mode changes from ductile to brittle. With the increase of pulse frequency, the grain size increases, the reduction of cross section decreases firstly and then increases. The increase of temperature due to applying of electropulse is considered as the main reason for the retardation of mechanical property and the change of fracture mode. Copper sulfide is found on the fracture surface, which may be the root cause for the electricity-induced embrittlement. Recrystallization induced by the presence of electricity inhibits the embrittlement and improves the plasticity of material. For undeformed copper, direct electrically assisted forming processing will decrease its plasticity, by contrast, for heavily deformed the copper, electrically assisted forming can reduce the flow stress and improve the plasticity.

Copper Electrically assisted forming Electropulsing treatment Fracture mode transition Tensile test

SCI ; EI

英语

第一 ; 通讯

National Science Foundation of China[51901098]

Materials Science

Materials Science, Multidisciplinary

WOS:000588264900001

ELSEVIER SCI LTD

20203909224118

Tensile strength ; Sulfur compounds ; Fracture ; Copper compounds ; Embrittlement ; Microstructure

Materials Science:951

MATERIALS SCIENCE

2-s2.0-85091237872

Scopus

Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen,1088 Xueyuan Blvd,518055,China

He，Jing,Zeng，Zhi,Li，Huabing,et al. The microstructure and mechanical properties of copper in electrically assisted tension[J]. Materials and Design,2020,196.

He，Jing,Zeng，Zhi,Li，Huabing,&Wang，Shuai.(2020).The microstructure and mechanical properties of copper in electrically assisted tension.Materials and Design,196.

He，Jing,et al."The microstructure and mechanical properties of copper in electrically assisted tension".Materials and Design 196(2020).