Residual Stress Analysis and Structural Parameters Optimization of Corrugated Diaphragms Applied to MEMs Device

The residual stress of the corrugated diaphragm seriously affects the yield, service life and reliability of the cavity type MEMS device. Therefore, this paper studies the reduction of residual stress by optimizing the structural parameters of the corrugated diaphragm applied to MEMS devices. The test results are in agreement with the simulation results, indicating that the residual stress of the corrugated diaphragm has a positive linear relationship with the thickness of the diaphragm and the interval of the V-shaped grooves, and has a quadratic function relationship with the width of the v-groove. The simulation predicts that when the thickness of the corrugated diaphragm and the interval of the V-shaped groove are the smallest, and the width of the V-shaped groove is close to 9.67 μm, the residual stress of the corrugated film has a minimum, which are consistent with the test results. The results serve as a guide and reference for cavity type MEMS device design.