南方科技大学知识苑(SUSTech KC): 4点曲げ試験による単結晶Siウエハの加工面性状評価

题名	4点曲げ試験による単結晶Siウエハの加工面性状評価
作者	Tatsuya FUJII ; Takuto MURAKAMI ; Yongbo WU ; Mitsuyoshi NOMURA ; 藤井達也 ; 村上拓斗 4,4; 呉勇波 3; 野村光由 4,4
发表日期	2019
DOI	10.11395/jjsem.19.131
发表期刊	実験力学影响因子和分区
ISSN	1346-4930
卷号	19 期号:2页码:131-136
摘要	Chemical mechanical polishing (CMP) is one of the effective surface-finishing methods for machining Si wafers. However, the conventional CMP process using free abrasive slurry has apparent disadvantages, such as low efficiency, high environmental burden and cost. As a promising technology for the machining of large-sized Si wafer, chemo-mechanical grinding (CMG) integrates the advantages of fixed abrasive machining and CMP process, and hence can generate superior surface quality comparable to that by CMP while maintaining the high geometric accuracy. In this laboratory, we proposed the ultrasonic assisted chemo-mechanical grinding (UA-CMG) process using fixed abrasive to enhance the material removal rate, attain the work-surface with little damage or defects. Although UA-CMG is effective for the improvement of surface roughness and surface morphologies, machined surface characteristics need to be further investigated. In this paper, the evaluation of machined surface texture (Particularly, tool mark and machining defects) using material testing technique is reported. Four-point bending tests of the single-crystal Si wafer processed using UA-CMG are conducted and the influence of surface texture on mechanical properties has been evaluated.
关键词	進化型多目的マルチタスク最適化手法親個体選択方法多目的最適化 evolutionary multiobjective multitasking parent selection multiobjective optimization英语演讲英语辩论学生投入大学英语教学 English Public Speaking English Debate Student Engagement College English TeachingMachined surface texture Si wafer Bending test Chemo-mechanical grinding (CMG) Ultrasonic Fracture strength Machining defects
相关链接	[万方记录]
语种	日文
学校署名	其他
来源库	WanFang
万方记录号	15e3e826eaa2eeecdffd5fa069ce08b9
引用统计	被引频次[WOS]：0
成果类型	期刊论文
条目标识符	http://sustech.caswiz.com/handle/2SGJ60CL/206085
专题	人文社会科学学院_语言中心工学院
作者单位	1.南方科技大学语言中心，广东深圳秋田県立大学システム科学技術学部 2.秋田県立大学 3.南方科技大学工学院 4.秋田県立大学
推荐引用方式 GB/T 7714	Tatsuya FUJII,Takuto MURAKAMI,Yongbo WU,等. 4点曲げ試験による単結晶Siウエハの加工面性状評価[J]. 実験力学,2019,19(2):131-136.
APA	Tatsuya FUJII.,Takuto MURAKAMI.,Yongbo WU.,Mitsuyoshi NOMURA.,藤井達也.,...&野村光由.(2019).4点曲げ試験による単結晶Siウエハの加工面性状評価.実験力学,19(2),131-136.
MLA	Tatsuya FUJII,et al."4点曲げ試験による単結晶Siウエハの加工面性状評価".実験力学 19.2(2019):131-136.