中文版 | English
题名

Fundamental investigation of ultrasonic vibration assisted MCF (Magnetic Compound Fluid) polishing

作者
通讯作者Nomura,Mitsuyoshi
发表日期
2017
会议录名称
页码
747-752
摘要
This research deals with the development of an ultrasonic vibration assisted MCF (Magnetic Compound Fluid) polishing technology for final polishing. This paper describes the fabrication of an experimental apparatus composed mainly of an ultrasonic polishing unit, and the experimental investigation of its performance in surface polishing. In addition, investigation of ultrasonic vibration assisted MCF polishing under different applied methods of ultrasonic vibration was also conducted. The experimental results indicate that applying ultrasonic vibration to the workpiece improves the surface roughness and the material removal rate when the ultrasonic vibrations are changed. In addition, over the range of polishing conditions employed in this paper, the precision surface roughness and high material removal rate can be easily obtained on the acrylic plate by using an elliptical vibration is applied to the ultrasonic vibration.
关键词
学校署名
其他
语种
英语
相关链接[Scopus记录]
收录类别
EI入藏号
20204409421552
EI主题词
Magnetism ; Ultrasonic effects ; Ultrasonic waves ; Polishing
EI分类号
Machining Operations:604.2 ; Magnetism: Basic Concepts and Phenomena:701.2 ; Ultrasonic Waves:753.1 ; Physical Properties of Gases, Liquids and Solids:931.2
Scopus记录号
2-s2.0-85094102625
来源库
Scopus
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/209370
专题工学院_机械与能源工程系
作者单位
1.Dept. of Machine Intelligence and Systems Engineering,Akita Prefectural University,Akita,84-4 Aza Ebinokuchi Tsuchiya Yurihonjo City,015-0055,Japan
2.DENSO TECHNO Co.,Ltd.,Obu City, Aichi,2-188 Chuo-cho,474-0025,Japan
3.Dept. of Mechanical and Energy Engineering,Southern University of Science and Technology,Nanshan, Shenzhen, Guangdong,1088 Xueyuan Rd.,518055 PRC,China
推荐引用方式
GB/T 7714
Nomura,Mitsuyoshi,Nojiri,Kenta,Wu,Yongbo,et al. Fundamental investigation of ultrasonic vibration assisted MCF (Magnetic Compound Fluid) polishing[C],2017:747-752.
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