题名 | A novel method to extract contact resistivity for thermoelectric semiconductor |
作者 | |
通讯作者 | Hu,Xiaokai |
发表日期 | 2021-02-01
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DOI | |
发表期刊 | |
ISSN | 0034-6748
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EISSN | 1089-7623
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卷号 | 92期号:2 |
摘要 | Contact electrical resistance is a critical issue to be addressed in thermoelectric modules. A commercial instrument in thermoelectricity is demonstrated for the first time to extract the contact resistivity of thermoelectric legs by use of the three options of the probe distance. The specimen comprises two legs of bismuth telluride that are connected with reflow soldering. The probe distances are calibrated with a homogeneous sample of constantan. The linear fittings between the electrical resistance and the probe gap are employed in the calibration and in deriving the contact resistivity. The contact resistivity of n-type Bi2Te3 and p-type Bi2Te3 with nickel plating to the Sn64Bi35Ag1 solder is determined to be 17.4 μω cm2 and 9.8 μω cm2 at ambient temperature, respectively. The contact resistivities at two other temperatures are extracted as well so that the contact resistivity as a function of temperature would be available from the proposed method. |
相关链接 | [Scopus记录] |
收录类别 | |
语种 | 英语
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学校署名 | 通讯
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WOS记录号 | WOS:000630920500004
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EI入藏号 | 20210809945866
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EI主题词 | Electric resistance
; Lead-free solders
; Narrow band gap semiconductors
; Probes
; Soldering
; Ternary alloys
; Thermoelectricity
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EI分类号 | Soldering:538.1.1
; Electricity: Basic Concepts and Phenomena:701.1
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ESI学科分类 | CHEMISTRY
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Scopus记录号 | 2-s2.0-85101452071
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来源库 | Scopus
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引用统计 |
被引频次[WOS]:3
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成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/221651 |
专题 | 理学院_物理系 |
作者单位 | 1.School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology (GUET),Guilin,541004,China 2.Shenzhen Key Laboratory for Thermoelectric Materials,Department of Physics,Southern University of Science and Technology (SUSTec),Shenzhen,518055,China |
第一作者单位 | 物理系 |
通讯作者单位 | 物理系 |
推荐引用方式 GB/T 7714 |
Hu,Xiaokai,Liu,Xixi,Guo,Zuteng,et al. A novel method to extract contact resistivity for thermoelectric semiconductor[J]. REVIEW OF SCIENTIFIC INSTRUMENTS,2021,92(2).
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APA |
Hu,Xiaokai,Liu,Xixi,Guo,Zuteng,&Zhu,Liming.(2021).A novel method to extract contact resistivity for thermoelectric semiconductor.REVIEW OF SCIENTIFIC INSTRUMENTS,92(2).
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MLA |
Hu,Xiaokai,et al."A novel method to extract contact resistivity for thermoelectric semiconductor".REVIEW OF SCIENTIFIC INSTRUMENTS 92.2(2021).
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条目包含的文件 | 条目无相关文件。 |
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