Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling

Yan, Qingwei1,2; Alam, Fakhr E.3; Gao, Jingyao1,4; Dai, Wen1,4; Tan, Xue1,4; Lv, Le1,4; Wang, Junjie5; Zhang, Huan5; Chen, Ding6; Nishimura, Kazuhito7; Wang, Liping8,9; Yu, Jinhong1,4; Lu, Jibao10; Sun, Rong10; Xiang, Rong11; Maruyama, Shigeo11; Zhang, Hang12; Wu, Sudong8,9; Jiang, Nan1,4; Lin, Cheng-Te1,4

2021-06-01

10.1002/adfm.202104062

ADVANCED FUNCTIONAL MATERIALS   影响因子和分区

1616-301X

1616-3028

Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to maintain system reliability and performance. In recent years, graphene-based TIMs received considerable interest due to the ultrahigh intrinsic thermal conductivity of graphene. However, the cooling efficiency of such TIMs is still limited by some technical difficulties, such as production-induced defects of graphene, poor alignment of graphene in the matrix, and strong phonon scattering at graphene/graphene or graphene/matrix interfaces. In this study, a 120 mu m-thick freestanding film composed of vertically aligned, covalently bonded graphene nanowalls (GNWs) is grown by mesoplasma chemical vapor deposition. After filling GNWs with silicone, the fabricated adhesive TIMs exhibit a high through-plane thermal conductivity of 20.4 W m(-1) K-1 at a low graphene loading of 5.6 wt%. In the TIM performance test, the cooling efficiency of GNW-based TIMs is approximate to 1.5 times higher than that of state-of-the-art commercial TIMs. The TIMs achieve the desired balance between high through-plane thermal conductivity and small bond line thickness, providing superior cooling performance for suppressing the degradation of luminous properties of high-power light-emitting diode chips.

covalently bonded structures graphene nanowalls high through-plane thermal conductivity mesoplasma chemical vapor deposition thermal interface materials

SCI ; EI

英语

NI期刊

通讯

National Key R&D Program of China[2017YFB0406000] ; Project of the Chinese Academy of Sciences["XDC07030100","XDA22020602","KFZD-SW-409","ZDKYYQ20200001","ZDRW-CN-2019-3"] ; CAS Youth Innovation Promotion Association[2020301] ; Science and Technology Major Project of Ningbo["2018B10046","2016S1002"] ; Natural Science Foundation of Ningbo[2017A610010] ; Foundation of State Key Laboratory of Solid lubrication[LSL-1912] ; National Key Laboratory of Science and Technology on Advanced Composites in Special Environments[6142905192806] ; K.C. Wong Education Foundation[GJTD-2019-13] ; China Postdoctoral Science Foundation[2020M681965] ; Key Program of the National Natural Science Foundation of China[51732005]

Chemistry ; Science & Technology - Other Topics ; Materials Science ; Physics

Chemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter

WOS:000664520400001

WILEY-V C H VERLAG GMBH

20212610545760

Adhesives ; Chemical vapor deposition ; Cooling ; Efficiency ; Graphene ; Interfaces (materials) ; Microelectronics ; Silicones ; Thermal insulating materials ; Thermal management (electronics)

Heat Insulating Materials:413.2 ; Thermodynamics:641.1 ; Heat Transfer:641.2 ; Nanotechnology:761 ; Chemical Reactions:802.2 ; Chemical Products Generally:804 ; Organic Polymers:815.1.1 ; Production Engineering:913.1 ; Materials Science:951

MATERIALS SCIENCE

Web of Science

1.Chinese Acad Sci, Ningbo Inst Mat Technol & Engn NIMTE, Zhejiang Key Lab Marine Mat & Protect Technol, Key Lab Marine Mat & Related Technol, Ningbo 315201, Peoples R China
2.Hunan Univ, Coll Mat Sci & Engn, Changsha 410082, Peoples R China
3.Univ Technol & Appl Sci, Appl Sci Sect, Dept Engn, Nizwa 611, Oman
4.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China
5.Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Peoples R China
6.Hunan Univ, Coll Mech & Vehicle Engn, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Peoples R China
7.Kogakuin Univ, Adv Nanoproc Engn Lab, Mech Engn, Tokyo 1920015, Japan
8.Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China
9.Southern Univ Sci & Technol, Guangdong Hong Kong Macao Joint Lab Photon Therma, Shenzhen 518055, Peoples R China
10.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
11.Univ Tokyo, Dept Mech Engn, Bunkyo Ku, 7-3-1 Hongo, Tokyo 1138656, Japan
12.Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China

Yan, Qingwei,Alam, Fakhr E.,Gao, Jingyao,et al. Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling[J]. ADVANCED FUNCTIONAL MATERIALS,2021,31.

Yan, Qingwei.,Alam, Fakhr E..,Gao, Jingyao.,Dai, Wen.,Tan, Xue.,...&Lin, Cheng-Te.(2021).Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling.ADVANCED FUNCTIONAL MATERIALS,31.

Yan, Qingwei,et al."Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned, Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling".ADVANCED FUNCTIONAL MATERIALS 31(2021).