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题名

Molecular dynamics simulation of color centers in silicon carbide by helium and dual ion implantation and subsequent annealing

作者
通讯作者Xu,Zongwei
发表日期
2021-09-01
DOI
发表期刊
ISSN
0272-8842
卷号47期号:17页码:24534-24544
摘要
Atomic and close-to-atomic scale fabrication with high yield for the color centers in silicon carbide is critical in developing its applications. Combined with Wigner-Seitz method and identify diamond structure method to consider the structure around the silicon vacancy (V), it is found that He ion implantation is more likely to fabricate a small number of silicon vacancies with complete structure but locating deep, while Si ion implantation is more likely to introduce more silicon vacancies with incomplete structure but a large number and closer to the near surface. Therefore, a method of dual ion implantation is proposed in this paper. By adjusting the ratio of He to Si ion concentration for dual ion implantation, the fabrication yield of color centers with depth below 5 nm can be increased compared with that of He implantation after high temperature annealing. Molecular dynamics (MD) simulation is employed to discover the underlying mechanism of V color center and damage evolution by helium ion and dual ion implantation into four-hexagonal silicon carbide (4H–SiC) with subsequent annealing. Density-functional theory (DFT) calculation proves that magnetic-spin polarization enhances the stability of carbon anti-vacancy pair (CV) defect, which indicates CV defects are more stable than V defects. The evolution of the V color centers of different defect models are also calculated at various temperatures by MD, and the dynamic process of V defects to CV defects is demonstrated. It is revealed that the decrease of the V color center at high temperature annealing is partly due to the transformation of some silicon vacancies to CV defects.
关键词
相关链接[Scopus记录]
收录类别
SCI ; EI
语种
英语
学校署名
其他
WOS记录号
WOS:000677931400001
EI入藏号
20212410502706
EI主题词
Annealing ; Color ; Color centers ; Density functional theory ; Helium ; Ion implantation ; Magnetic moments ; Silicon carbide ; Spin polarization
EI分类号
Heat Treatment Processes:537.1 ; Magnetism: Basic Concepts and Phenomena:701.2 ; Light/Optics:741.1 ; Physical Chemistry:801.4 ; Chemical Products Generally:804 ; Inorganic Compounds:804.2 ; Probability Theory:922.1 ; Atomic and Molecular Physics:931.3 ; Quantum Theory; Quantum Mechanics:931.4 ; High Energy Physics:932.1 ; Crystalline Solids:933.1
ESI学科分类
MATERIALS SCIENCE
Scopus记录号
2-s2.0-85107634779
来源库
Scopus
引用统计
被引频次[WOS]:16
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/241915
专题工学院_电子与电气工程系
作者单位
1.State Key Laboratory of Precision Measuring Technology & Instruments,Laboratory of Micro/Nano Manufacturing Technology,Tianjin University,Tianjin,300072,China
2.Fraunhofer Institute for Integrated Systems and Device Technology IISB,Erlangen,Schottkystrasse 10,91058,Germany
3.Department of Electrical and Electronic Engineering,Southern University of Science and Technology,Shenzhen,518055,China
4.State Key Laboratory for Mesoscopic Physics and Electron Microscopy Laboratory,School of Physics,Peking University,Beijing,100871,China
5.State Key Laboratory for Environment-friendly Energy Materials,Southwest University of Science and Technology,Mianyang,621010,China
6.CAS Key Laboratory of Quantum Information,University of Science and Technology of China,Hefei,230026,China
推荐引用方式
GB/T 7714
Fan,Yexin,Song,Ying,Xu,Zongwei,et al. Molecular dynamics simulation of color centers in silicon carbide by helium and dual ion implantation and subsequent annealing[J]. CERAMICS INTERNATIONAL,2021,47(17):24534-24544.
APA
Fan,Yexin.,Song,Ying.,Xu,Zongwei.,Dong,Bing.,Wu,Jintong.,...&Fang,Fengzhou.(2021).Molecular dynamics simulation of color centers in silicon carbide by helium and dual ion implantation and subsequent annealing.CERAMICS INTERNATIONAL,47(17),24534-24544.
MLA
Fan,Yexin,et al."Molecular dynamics simulation of color centers in silicon carbide by helium and dual ion implantation and subsequent annealing".CERAMICS INTERNATIONAL 47.17(2021):24534-24544.
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