题名 | Information Capacity of Spoof Plasmon Interconnects |
作者 | |
通讯作者 | Joy, S. R. |
DOI | |
发表日期 | 2018
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ISSN | 1944-9399
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EISSN | 1944-9380
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会议录名称 | |
卷号 | 2018-July
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会议地点 | Cork, Ireland
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出版地 | 345 E 47TH ST, NEW YORK, NY 10017 USA
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出版者 | |
摘要 | Spoof surface plasmon polariton (SSPP) mode realized in planar, patterned conductors to manage light beyond diffraction limit at a chosen frequency drew significant attention of late. We discuss that, SSPP interconnect can be a hybrid technology of electronics and optics that realizes electromagnetic mode propagation confined on an electrically conductive surface. Since an electrical ground is not required for spoof plasmon propagation, SSPP interconnect can constitute a tera-scale inter-chip communication channel overcoming any RC limitation imposed on the bandwidth. We have investigated theoretical limits on the information transfer capability and quantified the trade-off relation between cross-talk limited bandwidth density and information propagation length in SSPP based communication networks. |
关键词 | |
学校署名 | 其他
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语种 | 英语
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相关链接 | [来源记录] |
收录类别 | |
资助项目 | NSF[ECCS 1227879]
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WOS研究方向 | Science & Technology - Other Topics
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WOS类目 | Nanoscience & Nanotechnology
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WOS记录号 | WOS:000458785600168
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EI入藏号 | 20191006586692
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EI主题词 | Bandwidth
; Diffraction
; Economic and social effects
; Electromagnetic wave polarization
; Hybrid systems
; Information dissemination
; Nanotechnology
; Optical interconnects
; Surface plasmon resonance
; Surface plasmons
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EI分类号 | Electromagnetic Waves:711
; Semiconductor Devices and Integrated Circuits:714.2
; Information Theory and Signal Processing:716.1
; Nanotechnology:761
; Information Dissemination:903.2
; Mathematics:921
; Social Sciences:971
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来源库 | Web of Science
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引用统计 |
被引频次[WOS]:0
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成果类型 | 会议论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/24639 |
专题 | 南方科技大学 工学院_深港微电子学院 |
作者单位 | 1.Univ Michigan, Ann Arbor, MI 48105 USA 2.Southern Univ Sci & Technol, Shenzhen, Peoples R China |
推荐引用方式 GB/T 7714 |
Joy, S. R.,Erementchouk, M.,Yu, H.,et al. Information Capacity of Spoof Plasmon Interconnects[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2018.
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条目包含的文件 | 条目无相关文件。 |
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