Smart Microphone Array Design for Speech Enhancement in Financial VR and AR

Ma, Rui1; Liu, Guocheng1; Hao, Qi1; Wang, Cong2

10.1109/ICSENS.2017.8234178

2017

21689229

978-1-5090-1013-4

2017 IEEE SENSORS

2017-December

906-908

29 Oct.-1 Nov. 2017

Glasgow, United kingdom

345 E 47TH ST, NEW YORK, NY 10017 USA

IEEE

Signal quality is critical in speech recognition during Virtual Reality/Augmented Reality (VR/AR) based interactions, especially in financial applications. This paper presents a 6-element concave microphone array designed for the VR/AR headset. Two key processing methods are developed: (1) beamforming technique to enhance the signal along the target speech direction, and (2) ICA blind source separation to separate mixed speech signals. These two methods are further integrated to improve each other's performance and to achieve an intelligent target speech enhancement scheme. Different speech interactions in VR/AR financial transactions are investigated with the smart microphone array. Simulation and experiment results have demonstrated that the proposed system can improve SNR and yield a smaller WER (word error rate) in speech recognition.

microphone array speech enhancement VR/AR

第一 ; 通讯

英语

CPCI-S ; EI

Science and Innovation Committee of Shenzhen City[CKFW20160414153721743]

Engineering ; Remote Sensing

Engineering, Electrical & Electronic ; Remote Sensing

WOS:000427677500308

20181304943084

Audio signal processing ; Blind source separation ; Finance ; Microphones ; Speech communication ; Speech enhancement ; Virtual reality

Information Theory and Signal Processing:716.1 ; Computer Software, Data Handling and Applications:723 ; Speech:751.5 ; Acoustic Devices:752.1

Web of Science

1.Southern Univ Sci & Technol, Dept Comp Sci & Engn, Shenzhen 518055, Guangdong, Peoples R China
2.South China Univ Technol, Sch Automat Sci & Engn, Guangzhou 510641, Guangdong, Peoples R China

Ma, Rui,Liu, Guocheng,Hao, Qi,et al. Smart Microphone Array Design for Speech Enhancement in Financial VR and AR[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2017:906-908.