Quantitative Evaluation of Thermal Conductivity of Single-Bent Microwire Using Vanadium Dioxide Temperature Tag

Huang, Runqing1; Zhao, Yaxuan1; Wang, Zixu1; Gan, Yichen; Shen, Nan1; Amini, Abbas2; Shi, Run1; Cheng, Chun1,3,4,5

2021-10-01

10.1002/pssa.202100348

PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE   影响因子和分区

1862-6300

1862-6319

Stress/strain engineering is believed to be an effective way to adjust the thermal conductivity of materials dynamically or as needed. Compared with bulk materials, micro-/nanoscale structures can withstand greater stress/deformations that lead to evident changes in their thermal conductivity after undergoing stress/strain; this phenomenon has been predicted by theoretical simulations. Nevertheless, measuring the effective thermal conductivity of a single wire of a small size upon controllable bending angles has faced major challenges. Herein, a method using VO2 tag as a temperature indicator is developed to achieve the in situ quantitative measurement of the thermal conductivity of bent silicon microwires (MWs), where thermally insulated spider silk is used to adjust the position of the suspended end of wires for different bending angles. It is found that the thermal conductivity of Si wires increases and then decreases upon subsequent bending; it indicates that the thermal conductivity of MWs can be dynamically tuned by bending. Further studies reveal that the variation of thermal conductivity is reversible with small bending (elastic) and irreversible with large bending (plastic). With this setup, new thermophysical properties of materials are explored at small scales, and possible stress/strain-gated thermal switches emerge.

bending silicon microwires temperature tags thermal conductivity vanadium dioxides

SCI ; EI

英语

第一 ; 通讯

National Natural Science Foundation of China[91963129,51776094] ; Basic Research Project of Science and Technology Plan of Shenzhen[JCYJ20180504165655180] ; Foundation of Shenzhen Science and Technology Innovation Committee[JCYJ20180302174026262]

Materials Science ; Physics

Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter

WOS:000706576600001

WILEY-V C H VERLAG GMBH

20214211021541

Silicon ; Thermal conductivity ; Thermal Engineering ; Wire

Metal Forming:535.2 ; Nonferrous Metals and Alloys excluding Alkali and Alkaline Earth Metals:549.3 ; Thermodynamics:641.1 ; Inorganic Compounds:804.2

PHYSICS

Web of Science

1.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China
2.Western Sydney Univ, Ctr Infrastructure Engn, Kingswood, NSW 2751, Australia
3.Southern Univ Sci & Technol, Guangdong Prov Key Lab Energy Mat Elect Power, Shenzhen 518055, Peoples R China
4.Southern Univ Sci & Technol, Key Lab Energy Convers & Storage Technol, Minist Educ, Shenzhen 518055, Peoples R China
5.Southern Univ Sci & Technol, Guangdong Hong Kong Macao Joint Lab Photon, Shenzhen 518055, Peoples R China

Huang, Runqing,Zhao, Yaxuan,Wang, Zixu,et al. Quantitative Evaluation of Thermal Conductivity of Single-Bent Microwire Using Vanadium Dioxide Temperature Tag[J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE,2021,218.

Huang, Runqing.,Zhao, Yaxuan.,Wang, Zixu.,Gan, Yichen.,Shen, Nan.,...&Cheng, Chun.(2021).Quantitative Evaluation of Thermal Conductivity of Single-Bent Microwire Using Vanadium Dioxide Temperature Tag.PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE,218.

Huang, Runqing,et al."Quantitative Evaluation of Thermal Conductivity of Single-Bent Microwire Using Vanadium Dioxide Temperature Tag".PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE 218(2021).