Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling

Chen，Anqi1; Jiang，Fan1; Dong，Jiajia1; Chen，Jeffrey2; Zhu，Yuan1,3,4

2022-01-05

10.1016/j.applthermaleng.2021.117683

APPLIED THERMAL ENGINEERING   影响因子和分区

1359-4311

1873-5606

Ultra-thin loop heat pipe (UT-LHP) is a high-performance heat transfer component that satisfies the requirement of thermal management problems in miniaturized electronic devices. In this study, a novel UT-LHP with capillary wick structures is developed for mobile electronics cooling. By using a novel print wick structuring process on copper substrates, the total thickness of the UT-LHP can be decreased to only 0.3 mm. The effects of the filling ratio and wick structure distribution have been investigated to optimize the vapor–liquid circulation in the UT-LHP. The heat transfer performance of the UT-LHP has been evaluated under different heat loads and configurations. The minimal thermal resistance of the UT-LHP is 1.03 °C /W at a heat load of 3 W which corresponds to a heat flux of 3 W/cm. It is confirmed that the proposed UT-LHP can transfer a heat load of up to 3 W with low sensitivity to gravity. The proposed novel UT-LHP is a promising thermal solution for high-performance mobile electronic devices.

Heat transfer Mobile electronic devices Printed wick structure Thermal resistance Ultra-thin loop heat pipe

SCI ; EI

英语

第一 ; 通讯

Technology Innovation Commission of Shenzhen["JCYJ20190809154007586","JSGG20191129112212448"] ; Na-tional Key Research and Development Program of China[2017YFE0120800] ; National Natural Science Foundation of China[U20A20241] ; Science and Technology Development Fund of the Macao Special Administrative Region[FDCT/013/2017/AMJ]

Thermodynamics ; Energy & Fuels ; Engineering ; Mechanics

Thermodynamics ; Energy & Fuels ; Engineering, Mechanical ; Mechanics

WOS:000712099900003

PERGAMON-ELSEVIER SCIENCE LTD

20214211041720

Electronic cooling ; Electronic equipment ; Heat flux ; Heat resistance ; Thermal load ; Thermoelectric equipment

Thermoelectric Energy:615.4 ; Pipe, Piping and Pipelines:619.1 ; Heat Transfer:641.2

ENGINEERING

2-s2.0-85117193816

Scopus

1.School of Microelectronics,Southern University of Science and Technology,Shenzhen,518055,China
2.NeoGene Thermal Management Technology Co.,Ltd.,Guangzhou,510700,China
3.Key Laboratory of Energy Conversion and Storage Technology (Southern University of Science and Technology),Ministry of Education,Shenzhen,518055,China
4.Engineering Research Center of Integrated Circuits for Next-Generation Communications,Ministry of Education,Southern University of Science and Technology,Shenzhen,518055,China

Chen，Anqi,Jiang，Fan,Dong，Jiajia,et al. Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling[J]. APPLIED THERMAL ENGINEERING,2022,200.

Chen，Anqi,Jiang，Fan,Dong，Jiajia,Chen，Jeffrey,&Zhu，Yuan.(2022).Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling.APPLIED THERMAL ENGINEERING,200.

Chen，Anqi,et al."Design, fabrication and thermal performance of a novel ultra-thin loop heat pipe with printed wick structure for mobile electronics cooling".APPLIED THERMAL ENGINEERING 200(2022).