Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Liu, Xu1; Zhou, Quan2,3; Zhao, Xu4; Koh, Sau Wee5; Ye, Huaiyu6; Zhang, Guoqi7

10.1109/ECTC32696.2021.00304

2021

IEEE 71st Electronic Components and Technology Conference (ECTC)

0569-5503

2377-5726

978-1-6654-3120-0

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)

2021-June

1928-1932

JUN 01-JUL 04, 2021

null,null,ELECTR NETWORK

10662 LOS VAQUEROS CIRCLE, PO BOX 3014, LOS ALAMITOS, CA 90720-1264 USA

IEEE COMPUTER SOC

Nano-metal sintering has been proven to be a promising die attachment technology for power electronics packaging in the high-end application. Compared with nano silver technology, it is believed that copper-based sintering technology has better cost and performance superiority, and thus has more potential to be utilized in the industry in the future. However, most of the current developed nano copper sintering material and technology shows bad performance with high sintering energy input. In this study, a novel nano-copper based paste has been developed with excellent process ability (sinterable below 280 degrees C for 10 min with low pressure assisted) and good material property (over 40 MPa shear strength), which turns out to be suitable for the state-of-the-art packaging process. Then the material was applied into a SiC power module packaging scenario which shows comparable performance as silver sintering. The whole process only consumed less than 0.5h for each batch, which indicates that the copper sintering technology has great potential for the packaging application in high power situation.

power electronics packaging nano Cu sintering shear strength thermal behavior reliability performance

通讯

英语

CPCI-S ; EI

National Key R&D Program of China[2018YFE0204600]

Engineering

Engineering, Electrical & Electronic

WOS:000702282700292

20220811668654

Copper ; Electronics packaging ; Power electronics ; Shear strength ; Silicon carbide ; Silver

Copper:544.1 ; Precious Metals:547.1 ; Inorganic Compounds:804.2

Web of Science

1.Delft Univ Technol, Elect Components Technol & Mat, Delft, Netherlands
2.Chongqing Univ, Key Lab Optoelect Technol & Syst, Educ Minist China, Chongqing, Peoples R China
3.Chongqing Univ, Coll Optoelect Engn, Chongqing, Peoples R China
4.Shenzhen Inst Wide Bandgap Semicond, Shenzhen, Peoples R China
5.Huawei Technol, Shengzhen, Peoples R China
6.Southern Univ Sci & Technol, Shenzhen Inst Wide Bandgap Semicond, Shenzhen, Peoples R China
7.Delft Univ Technol, Dept Microelect, Delft, Netherlands

Liu, Xu,Zhou, Quan,Zhao, Xu,et al. Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging[C]. 10662 LOS VAQUEROS CIRCLE, PO BOX 3014, LOS ALAMITOS, CA 90720-1264 USA:IEEE COMPUTER SOC,2021:1928-1932.