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题名

Bias-normal index: A new indicator of dense random packing for thermal polymer/ceramic composites

作者
通讯作者Zhu,Yuan
发表日期
2021
DOI
发表期刊
ISSN
0272-8842
卷号48期号:3页码:4361-4365
摘要

Thermal composites are widely used in thermal management. Usually, they consist of polymers and fillers. In pursuit of higher thermal conductivity, the fillers are mostly spherical particles for higher packing density. In previous work, the relationship between particle size distribution (PSD) and packing density was studied, especially the parameters such as polydispersity δ and the skewness S are defined to characterize the PSD. However, in our observation, for sieving process, which is very helpful in manipulating PSD and thus tuning thermal conductivity, δ and S are not good enough to explain most of the compositing results. Here, we suggest a new set of indices (bias-normal indices) to evaluate the sieving efficacy. Three kinds of ceramic powders (MgO, AlO, and AlN) and their single- and triple-order composites materials were prepared. The results show that the explanations based on bias-normal ratio index agree well with all the experiments. Thus, this new indicator is competent in guiding the recipe design of the thermal composite materials, and when well-designed recipes are employed, sieving is proven an efficient and simple way to promote the thermal performance, which is of great practical value.

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相关链接[Scopus记录]
收录类别
SCI ; EI
语种
英语
学校署名
第一 ; 通讯
EI入藏号
20214411105114
EI主题词
Alumina ; Aluminum nitride ; Aluminum oxide ; Composite materials ; Fillers ; III-V semiconductors ; Light transmission ; Magnesia ; Nitrogen compounds ; Particle size ; Powders ; Size distribution ; Thermal conductivity
EI分类号
Thermodynamics:641.1 ; Semiconducting Materials:712.1 ; Light/Optics:741.1 ; Organic Compounds:804.1 ; Inorganic Compounds:804.2 ; Mathematical Statistics:922.2 ; Materials Science:951
ESI学科分类
MATERIALS SCIENCE
引用统计
被引频次[WOS]:3
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/254861
专题工学院_深港微电子学院
前沿与交叉科学研究院
创新创业学院
作者单位
1.School of Microelectronics,Southern University of Science and Technology,Shenzhen,518055,China
2.School of Innovation and Entrepreneurship,Southern University of Science and Technology,Shenzhen,518055,China
3.Academy for Advanced Interdisciplinary Studies,Southern University of Science and Technology,Shenzhen,518055,China
4.Foshan (Southern China) Institute for New Materials,Foshan,528000,China
5.Key Laboratory of Energy Conversion and Storage Technologies,Ministry of Education,Southern University of Science and Technology,Shenzhen,518055,China
6.Engineering Research Center of Integrated Circuits for Next-Generation Communications,Ministry of Education,Southern University of Science and Technology,Shenzhen,518055,China
第一作者单位深港微电子学院
通讯作者单位深港微电子学院;  创新创业学院;  南方科技大学
第一作者的第一单位深港微电子学院
推荐引用方式
GB/T 7714
Lv,You,E,Yiyang,Tian,Zhaobo,et al. Bias-normal index: A new indicator of dense random packing for thermal polymer/ceramic composites[J]. CERAMICS INTERNATIONAL,2021,48(3):4361-4365.
APA
Lv,You,E,Yiyang,Tian,Zhaobo,Chi,Keyu,Sun,Qi,&Zhu,Yuan.(2021).Bias-normal index: A new indicator of dense random packing for thermal polymer/ceramic composites.CERAMICS INTERNATIONAL,48(3),4361-4365.
MLA
Lv,You,et al."Bias-normal index: A new indicator of dense random packing for thermal polymer/ceramic composites".CERAMICS INTERNATIONAL 48.3(2021):4361-4365.
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