题名 | An Invar Alloy SLM Printed Diplexer With High Thermal Stability |
作者 | |
发表日期 | 2022-03
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DOI | |
发表期刊 | |
ISSN | 1558-3791
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卷号 | 69期号:3页码:1019-1023 |
关键词 | |
相关链接 | [IEEE记录] |
收录类别 | |
学校署名 | 其他
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EI入藏号 | 20214411102845
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EI主题词 | Bandpass filters
; Microwave filters
; Microwave resonators
; Multiplexing equipment
; Printing presses
; Temperature measurement
; Thermal expansion
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EI分类号 | Thermodynamics:641.1
; Electric Filters:703.2
; Electronic Components and Tubes:714
; Printing Equipment:745.1.1
; Temperature Measurements:944.6
; Materials Science:951
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来源库 | IEEE
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全文链接 | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9577205 |
引用统计 |
被引频次[WOS]:7
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成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/254862 |
专题 | 工学院_电子与电气工程系 |
作者单位 | 1.Dept. of Information and Communication Engineering, Xi’an Jiaotong University, Xi’an, CN 710100, China. 2.Dept. of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen, 518055, P. R. China, also with the Department of Electronic, Electrical and Systems Engineering, University of Birmingham, Edgbaston, Birmingham B15 2TT, U.K. 3.Dept. of Information and Communication Engineering, Xi’an Jiaotong University, Xi’an, CN 710100, China. (e-mail: guocheng@xjtu.edu.cn) 4.Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China. 5.National Key Laboratory of Science and Technology on Space Microwave, China Academy of Space Technology, Xi’an, 710100, China. |
推荐引用方式 GB/T 7714 |
Wen,Xiaozhu,Yu,Yang,Tian,Chunming,et al. An Invar Alloy SLM Printed Diplexer With High Thermal Stability[J]. IEEE Transactions on Circuits and Systems II: Express Briefs,2022,69(3):1019-1023.
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APA |
Wen,Xiaozhu.,Yu,Yang.,Tian,Chunming.,Guo,Cheng.,Wu,Wenxuan.,...&Zhang,Anxue.(2022).An Invar Alloy SLM Printed Diplexer With High Thermal Stability.IEEE Transactions on Circuits and Systems II: Express Briefs,69(3),1019-1023.
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MLA |
Wen,Xiaozhu,et al."An Invar Alloy SLM Printed Diplexer With High Thermal Stability".IEEE Transactions on Circuits and Systems II: Express Briefs 69.3(2022):1019-1023.
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