Effects of cetyltrimethylammonium bromide (CTAB) on electroplating twin-structured copper interconnects

Dong，Yi1,2; Li，Zhe1; Gao，Li Ying1; Li，Xiao1; Liu，Zhi Quan1; Sun，Rong1

10.1109/ICEPT52650.2021.9567924

2021-09-14

978-1-6654-1392-3

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

1-6

14-17 Sept. 2021

Xiamen, China

Twin-structured copper possesses great potential in advanced interconnect electroplating because of high performance and high reliability. Whereas, the issue of surface nonuniformity restricts its practices in integrated circuits and demands a prompt solution. A novel additive strategy based on coexisting cetyltrimethylammonium bromide (CTAB) and gelatin is proposed and effects of CTAB to bath electrochemistry and material properties are investigated. With an optimum concentration of CTAB, the electroplating formular enables improved surface leveling and filling height coplanarity for twin-structured copper filling in 15/15m line/space redistribution layer (RDL) patterns.

copper electroplating CTAB RDL twin structure

其他

英语

EI

20214511119712

Copper ; Integrated circuit interconnects

Electroplating:539.3.1 ; Copper:544.1 ; Semiconductor Devices and Integrated Circuits:714.2

2-s2.0-85118458838

Scopus

1.Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences (CAS),Shenzhen,518055,China
2.College of Engineering,Southern University of Science and Technology,Shenzhen,518055,China

Dong，Yi,Li，Zhe,Gao，Li Ying,et al. Effects of cetyltrimethylammonium bromide (CTAB) on electroplating twin-structured copper interconnects[C],2021:1-6.