The Influence of Molding Compound Properties on System-in-Package Reliability for 5G Application

Liu，Dashun1; Chen，Kai1; Qin，Yijing1; Zhong，Yong1; Wan，Zhaorong1; Liu，Richeng1; Lu，Dong1; Xue，Ke2; Wu，Jingshen1

10.1109/ICEPT52650.2021.9567717

2021-09-14

978-1-6654-1392-3

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

1-6

14-17 Sept. 2021

Xiamen, China

With the development of electronic packaging technology, devices become much smaller size and higher integration, and the reliability of devices has become one of the most concerned issues. Interfacial delamination has become one of the significant factors influencing the reliability of devices in System-in- Package (SiP) module with the rapid development of the fifth generation (5G) technology. In this work, a method for interface delamination modeling considering cure shrinkage and viscoelasticity was proposed, which could predict the interfacial delamination accurately. Combining the theoretical calculation formula and the warpage test results, the cure shrinkage rate of the Epoxy molding compound (EMC) was calculated. The parameters of EMC viscoelastic constitutive model (Maxwell model) were obtained by Dynamic mechanical analysis (DMA) test. Based on the Finite element analysis, the warpage deformation during reflow process was simulated by adjusting the CTE value of the EMC until it was consistent with the actual results from of shadow moiré test. Furthermore, using the cohesive force zone modelling (CZM), simulation for interface delamination of Cu/EMC was carried out by using ABAQUS. The influences of residual stress of cure shrinkage and viscoelastic of EMC at high temperature on the delamination failure of the device were also considered.

5G Cohesive Zone Model Delamination Epoxy Molding Compound Viscoelasticity

其他

英语

EI

20214511119685

Curing ; Electromagnetic compatibility ; Molding ; Reliability ; Sheet molding compounds ; Shrinkage ; System-in-package ; Viscoelasticity

Electromagnetic Waves in Different Media:711.1 ; Semiconductor Devices and Integrated Circuits:714.2 ; Radio Systems and Equipment:716.3 ; Chemical Reactions:802.2 ; Processing of Plastics and Other Polymers:816.1 ; Polymer Products:817.1 ; Physical Properties of Gases, Liquids and Solids:931.2 ; Materials Science:951

2-s2.0-85118441432

Scopus

1.Center for Engineering Materials and Reliability,Guangzhou Hkust Fok Ying Tung Research Institute,Guangzhou,China
2.School of System Design and Intelligent Manufacturing,Southern University of Science and Technology,Shenzhen,China

Liu，Dashun,Chen，Kai,Qin，Yijing,et al. The Influence of Molding Compound Properties on System-in-Package Reliability for 5G Application[C],2021:1-6.