The Impact of Packaging Materials on Thermomechanical Reliability of FC-LGA (Flip-Chip Land Grid Array) Package for 5G Application

Wan，Dayuan1; Xue，Ke1; Dai，Weijing1; Qin，Yijing2; Lu，Dong2; Wang，Zhiqi3; Chen，Yi3

10.1109/ICEPT52650.2021.9568198

2021-09-14

978-1-6654-1392-3

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

1-5

14-17 Sept. 2021

Xiamen, China

With the advent of the 5G era, power devices and telecom equipment require small form factor and excellent thermal performance. Flip-chip Land Grid Array (FC-LGA) is rapidly becoming the package choice for those devices, because of its low RDS (ON) and high frequency operation. However, it also brings great challenges to reliability design. Large number of flip chip solder joints between die and substrate lead to a more rigid package body, which will accumulate strong thermomechanical stress under alternating temperature and so inevitably trigger package reliability issues. Excessive warpage and body crack will occur if without appropriate package design consideration. In this study, the thermo-mechanical behaviors of FC-LGA were investigated by finite element simulation under different TCC conditions. Due to the complexity of the LGA substrate, the simulation with detail substrate model in use will incur expensive computation. This work proposed a simplification method considering a substrate of complicated structure as an equivalent anisotropic volume. With simulation models simplified, DoE study was performed to investigate the influence of packaging materials and geometry on the thermo-mechanical reliability of FC-LGA packages in high efficiency. A higher die-to-EMC thickness ratio will result in a more severe package convex warpage, while using a thinner die and a thicker EMC layer can prevent package body from cracking during heating or cooling processes. Besides packaging geometry, the influence of substrate layouts and EMC mechanical properties were also studied to find the optimal packaging design to mitigate the risks of excessive package warpage and body crack.

Crack Finite element method Flip-Chip land grid array Thermo-mechanical reliability Warpage

第一

英语

EI

20214511119542

5G mobile communication systems ; Chip scale packages ; Electromagnetic compatibility ; Flip chip devices ; Network components ; Packaging ; Packaging materials ; Reliability ; Substrates

Packaging, General:694.1 ; Packaging Materials:694.2 ; Electromagnetic Waves in Different Media:711.1 ; Semiconductor Devices and Integrated Circuits:714.2 ; Radio Systems and Equipment:716.3 ; Numerical Methods:921.6

2-s2.0-85118430604

Scopus

1.Southern University of Science and Technology,School of System Design and Intelligent Manufacturing,Shenzhen,China
2.Center for Engineering Materials and Reliability,Guangzhou Hkust Fok Ying Tung Research Institute,Guangzhou,China
3.Chengdu Monolithic Power Systems Co. Ltd,Chengdu,China

Wan，Dayuan,Xue，Ke,Dai，Weijing,et al. The Impact of Packaging Materials on Thermomechanical Reliability of FC-LGA (Flip-Chip Land Grid Array) Package for 5G Application[C],2021:1-5.