Cure Shrinkage Characterization and Warpage Simulation Optimization of Epoxy Molding Compound for 5G Application

Chen，Kai1; Liu，Dashun1; Qin，Yijing1; Zhong，Yong1; Wan，Zhaorong1; Liu，Richeng1; Lu，Dong1; Xue，Ke2; Wu，Jingshen2

10.1109/ICEPT52650.2021.9567930

2021-09-14

978-1-6654-1392-3

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

1-5

14-17 Sept. 2021

Xiamen, China

With the development of electronic packaging technology in 5G era, System-in-Package (SiP) module is developing into smaller size and higher integration to realize the multi-functional applications, and the reliability of SiP module, especially the interfacial delamination has become one of the most concerned issues. To predict interfacial delamination precisely through modeling and simulation methodologies, accurate warpage of SiP module should be calculated accordingly since warpage deformation is one of the main reasons of interface delamination. For plastic packaged devices, like most SiP modules, coefficient of thermal expansion (CTE) mismatch between epoxy molding compound (EMC) and its adjacent materials will lead to warpage during the process of transfer molding and post-mold cure of EMC. In addition to this, another important reason of warpage is the chemical shrinkage of EMC during curing process. In this work, a method of characterizing cure shrinkage of EMC was proposed by using bi-material test method. The cure shrinkage rate of EMC was calculated combining the simulation methods and the warpage test results, which was applied in optimizing the SiP module warpage simulation during reflow process. Furthermore, the effect of viscoelasticity of EMC on SiP module warpage was also investigated in this work.

5G Cure shrinkage Epoxy molding compound Viscoelasticity Warpage simulation

其他

英语

EI

20214511119718

Curing ; Electromagnetic compatibility ; Molding ; Sheet molding compounds ; Shrinkage ; Silicon compounds ; System-in-package ; Testing ; Thermal expansion ; Viscoelasticity

Thermodynamics:641.1 ; Electromagnetic Waves in Different Media:711.1 ; Semiconductor Devices and Integrated Circuits:714.2 ; Radio Systems and Equipment:716.3 ; Chemical Reactions:802.2 ; Processing of Plastics and Other Polymers:816.1 ; Polymer Products:817.1 ; Physical Properties of Gases, Liquids and Solids:931.2 ; Materials Science:951

2-s2.0-85118424311

Scopus

1.Center for Engineering Materials and Reliability,Guangzhou Hkust Fok Ying Tung Research Institute,Guangzhou,China
2.School of System Design and Intelligent Manufacturing,Southern University of Science and Technology,Shenzhen,China

Chen，Kai,Liu，Dashun,Qin，Yijing,et al. Cure Shrinkage Characterization and Warpage Simulation Optimization of Epoxy Molding Compound for 5G Application[C],2021:1-5.