Theoretical model of warping deformation during self-rotating grinding of YAG wafers

Li，Chen1; Hu，Yuxiu1; Huang，Shuqiang1; Meng，Binbin2; Piao，Yinchuan1; Zhang，Feihu1

2021

10.1016/j.ceramint.2021.10.250

CERAMICS INTERNATIONAL   影响因子和分区

0272-8842

1873-3956

YAG wafers are the most host laser crystals used for high-power lasers, which are usually machined by grinding to meet the required accuracy for laser components. Warping deformation induced by the residual stress is one of the main damages for YAG wafers after the grinding process, which will seriously decrease the service accuracy and life of the lasers. Developing theoretical model of warping deformation is of great significance to achieving the ultra-precision machining of YAG wafers. The cutting depth of single abrasive and grinding force in self-rotating grinding were investigated by considering the kinematic trajectory of abrasives, brittle-to-ductile transition, elastic mechanics, elastic deformation of the grinding wheel and strain rate effect. A theoretical model of warping deformation in self-rotating grinding of YAG wafers was developed based on the cutting depth and grinding force. The influence of subsurface damage and residual stress on warping deformation was analyzed based on the theoretical model and finite element simulation. Self-rotating grinding tests of YAG wafers were performed, and the results showed that the warping deformation decreased as the wheel rotational speed increased, and increased as the abrasive size, workpiece rotational speed and feed speed increased. The experimental results agreed well with the simulated results of the theoretical model, indicating that the theoretical model can accurately predict the warping deformation induced by self-rotating grinding process. This work will not only enhance the understanding of the essence of the wafer warping induced by ultra-precision machining, but also provide a guide for optimizing the processing parameters in self-rotating grinding of YAG wafers.

Grinding force Self-rotating grinding Theoretical model Warping YAG

SCI ; EI

英语

其他

National Natural Science Foundation of China[52005134,51975154,51905254] ; China Postdoctoral Science Foundation[2020M670901] ; Heilongjiang Postdoctoral Fund[LBH-Z20016]

Materials Science

Materials Science, Ceramics

WOS:000743462400002

ELSEVIER SCI LTD

20214511131804

Grinding wheels ; High power lasers ; Precision engineering ; Residual stresses ; Strain rate ; Yttrium aluminum garnet

Machining Operations:604.2 ; Lasers, General:744.1 ; Inorganic Compounds:804.2

MATERIALS SCIENCE

2-s2.0-85118536277

Scopus

1.School of Mechatronics Engineering,Harbin Institute of Technology,Harbin,150001,China
2.Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen,518055,China

Li，Chen,Hu，Yuxiu,Huang，Shuqiang,et al. Theoretical model of warping deformation during self-rotating grinding of YAG wafers[J]. CERAMICS INTERNATIONAL,2021,48(4):4637-4648.

Li，Chen,Hu，Yuxiu,Huang，Shuqiang,Meng，Binbin,Piao，Yinchuan,&Zhang，Feihu.(2021).Theoretical model of warping deformation during self-rotating grinding of YAG wafers.CERAMICS INTERNATIONAL,48(4),4637-4648.

Li，Chen,et al."Theoretical model of warping deformation during self-rotating grinding of YAG wafers".CERAMICS INTERNATIONAL 48.4(2021):4637-4648.