A non-contact thermal testing system for ultra-thin vapor chamber

Jiang, Xinyue1,2; Chen, Anqi1; Jiang, Fan1; Guo, Wei1; Lv, You1; Sun, Qi3; Cui, Wei3; Lee, Fang-Shou4; Zhu, Yuan1,5,6,7

2021-12-01

10.1063/5.0070768

REVIEW OF SCIENTIFIC INSTRUMENTS   影响因子和分区

0034-6748

1089-7623

An ultra-thin vapor chamber (UTVC) is an efficient heat transfer component that meets the heat dissipation requirement of miniaturized electronic devices. Heat dissipation is one of the most important issues for UTVCs. With decreasing thickness, the mechanical strength of heat pipes and vapor chambers drops dramatically, and inevitable surface damage occurs during conventional contact thermal testing. Here, we demonstrate a non-contact thermal testing method using laser heating and infrared temperature measurement to evaluate the thermal performance of UTVCs. This non-contact method allows UTVCs to reach a steady-state sooner than traditional contact methods. Use of the characteristic thermal resistance is proposed for more straightforward evaluation of the UTVC thermal performance in non-contact testing setups. This non-contact thermal testing method has proved to be an efficient testing method for UTVCs due to its rapidity, accuracy, and non-destructiveness.

SCI ; EI

英语

第一 ; 通讯

Science and Technology Innovation Commission of Shenzhen["JCYJ20190809154007586","JSGG20191129112212448"] ; National Key Research and Development Program of China[2017YFE0120800] ; National Natural Science Foundation of China[U20A20241] ; Science and Technology Development Fund of the Macao Special Administrative Region[FDCT/013/2017/AMJ]

Instruments & Instrumentation ; Physics

Instruments & Instrumentation ; Physics, Applied

WOS:000731948200004

AIP Publishing

20220211432632

Heat transfer ; Temperature measurement

Pipe, Piping and Pipelines:619.1 ; Heat Transfer:641.2 ; Temperature Measurements:944.6

CHEMISTRY

Web of Science

1.Southern Univ Sci & Technol, Sch Microelect, Shenzhen 518055, Peoples R China
2.Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China
3.Foshan Southern China Inst New Mat, Foshan 528000, Guangdong, Peoples R China
4.Long Win Sci & Technol Corp, Taoyuan 32657, Taiwan
5.Southern Univ Sci & Technol, Sch Innovat & Entrepreneurship, Shenzhen 518055, Peoples R China
6.Southern Univ Sci & Technol, Minist Educ, Key Lab Energy Convers & Storage Technol, Shenzhen 518055, Peoples R China
7.Southern Univ Sci & Technol, Engn Res Ctr Integrated Circuits Next Generat Com, Minist Educ, Shenzhen 518055, Peoples R China

Jiang, Xinyue,Chen, Anqi,Jiang, Fan,et al. A non-contact thermal testing system for ultra-thin vapor chamber[J]. REVIEW OF SCIENTIFIC INSTRUMENTS,2021,92(12).

Jiang, Xinyue.,Chen, Anqi.,Jiang, Fan.,Guo, Wei.,Lv, You.,...&Zhu, Yuan.(2021).A non-contact thermal testing system for ultra-thin vapor chamber.REVIEW OF SCIENTIFIC INSTRUMENTS,92(12).

Jiang, Xinyue,et al."A non-contact thermal testing system for ultra-thin vapor chamber".REVIEW OF SCIENTIFIC INSTRUMENTS 92.12(2021).