A comprehensive study on electrochemical polishing of tungsten

Wang, Fang1,2; Zhang, Xinquan3; Deng, Hui1

2019-05

10.1016/j.apsusc.2019.01.020

APPLIED SURFACE SCIENCE   影响因子和分区

0169-4332

1873-5584

Tungsten is a promising material for the mold of glass components owing to its excellent mechanical and chemical properties. Electrochemical polishing (ECP) has been proposed for the damage-free and highly efficient surface finishing of tungsten. In the paper, a comprehensive study of the anodic behaviors of tungsten during ECP under different applied potentials has been carried out. A mirror surface with a Sa roughness of 3.73 nm has been obtained by ECP for 10 mins demonstrating its effectiveness. The changes of surface morphology, roughness and electric current under different potentials have been experimentally investigated and analyzed. On the basis of the changes of surface morphology and current density, ECP of tungsten was divided into 3 stages including the etching stage in which rough etching marks were formed by crystallographic etching, the brightening stage in which ultra-smooth surfaces with clear boundaries were obtained and the pitting stage in which crystallographic pitting occurred. The probable material removal mechanisms of these 3 ECP stages were proposed and experimentally validated. The presented findings are of great value for understanding and process development of ECP of tungsten.

Tungsten alloy Electrochemical polishing Crystallographic etching Brightening Pitting

SCI ; EI

英语

第一 ; 通讯

Research Fund for International Cooperation from the Science and Technology Innovation Committee of Shenzhen Municipality[GJHZ20180411143558312]

Chemistry ; Materials Science ; Physics

Chemistry, Physical ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter

WOS:000458482100069

ELSEVIER

20190206354518

Electrolytic polishing ; Pitting ; Polishing ; Surface morphology ; Surface roughness ; Tungsten alloys

Metals Corrosion:539.1 ; Tungsten and Alloys:543.5 ; Machining Operations:604.2 ; Physical Properties of Gases, Liquids and Solids:931.2

MATERIALS SCIENCE

Web of Science

1.Southern Univ Sci & Technol, Dept Mech & Energy Engn, 1088 Xueyuan Rd, Shenzhen 518055, Guangdong, Peoples R China
2.Univ Hong Kong, Dept Mech Engn, Hong Kong 999077, Peoples R China
3.Singapore Inst Mfg Technol, 71 Nanyang Dr, Singapore 638075, Singapore

Wang, Fang,Zhang, Xinquan,Deng, Hui. A comprehensive study on electrochemical polishing of tungsten[J]. APPLIED SURFACE SCIENCE,2019,475:587-597.

Wang, Fang,Zhang, Xinquan,&Deng, Hui.(2019).A comprehensive study on electrochemical polishing of tungsten.APPLIED SURFACE SCIENCE,475,587-597.

Wang, Fang,et al."A comprehensive study on electrochemical polishing of tungsten".APPLIED SURFACE SCIENCE 475(2019):587-597.