南方科技大学知识苑(SUSTech KC): A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs

题名	A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs
作者	Wu，Xinzhi 1; Han，Zhijia 1; Zhu，Yongbin1 ; Deng，Biao 1 ; Zhu，Kang1 ; Liu，Chengyan3 ; Jiang，Feng1 ; Liu，Weishu1,2
通讯作者	Liu，Weishu
发表日期	2022-03-01
DOI	10.1016/j.actamat.2021.117616
发表期刊	ACTA MATERIALIA 影响因子和分区
ISSN	1359-6454
EISSN	1873-2453
卷号	226
摘要	The reliability of thermoelectric power generators (TEGs) depends heavily on the contact interface between thermoelectric (TE) materials and electrodes. We propose a general alloying approach for generating TE interface materials (TEiMs) for n-type MgSbBi systems. The TEiM serves as a metallisation layer or barrier that precedes the soldering assembly. We first selected Fe from 15 elements as the matrix element considering the criteria of high bonding strength and low interfacial resistivity. Following the principles of high bonding propensity, coefficient of thermal expansion (CTE) matching, diffusion passivation, and dopant inactivation, two types of ternary alloys (FeMgCr and FeMgTi) with shear strengths (σ) of > 40 MPa and the specific contact resistivities (ρ) of < 5 µΩ cm were obtained. Furthermore, the thermal stability of the TEiM/MgSbBi contact interface was investigated employing aging treatment. The contact interface exhibited high shear strength (σ>30MPa), low specific contact resistivity (ρ<10μΩcm), and excellent thermal stability after aging treatment at 400 °C for 15 days. The general TEiM design strategy presented herein will contribute to further optimization of contact interfaces in TEG devices.
关键词	bonding strength interfacial resistivity interfacial thermal stability Mg3Sb1.5Bi0.5 Thermoelectric interface materials
相关链接	[Scopus记录]
收录类别	SCI ; EI
语种	英语
学校署名	第一 ; 通讯
资助项目	National Key Project of Research and Development Plan[2018YFB0703600] ; NSFC Program[51872133] ; Guangdong Innovative and Entrepreneurial Research Team Program[2016ZT06G587] ; Shenzhen Key Projects of Long-Term Support Plan[2020 09251640210 02] ; Guangdong Provincial Key Laboratory Program-Department of Science and Technology of Guangdong Province[2021B1212040 0 01]
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000804680600004
出版者	PERGAMON-ELSEVIER SCIENCE LTD
EI入藏号	20220211438729
EI主题词	Chromium alloys ; Diffusion bonding ; Iron alloys ; Ternary alloys ; Thermal expansion ; Thermodynamic stability ; Thermoelectric power ; Titanium alloys
EI分类号	Titanium and Alloys:542.3 ; Chromium and Alloys:543.1 ; Iron Alloys:545.2 ; Thermodynamics:641.1 ; Materials Science:951
ESI学科分类	MATERIALS SCIENCE
Scopus记录号	2-s2.0-85122317928
来源库	Scopus
引用统计	被引频次[WOS]：36
成果类型	期刊论文
条目标识符	http://sustech.caswiz.com/handle/2SGJ60CL/264251
专题	工学院_材料科学与工程系理学院_物理系
作者单位	1.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,518055,China 2.Guangdong Provincial Key Laboratory of Functional Oxide Materials and Devices,Southern University of Science and Technology,Shenzhen,518055,China 3.Department of Physics,Southern University of Science and Technology,Shenzhen,518055,China
第一作者单位	材料科学与工程系
通讯作者单位	材料科学与工程系; 南方科技大学
第一作者的第一单位	材料科学与工程系
推荐引用方式 GB/T 7714	Wu，Xinzhi,Han，Zhijia,Zhu，Yongbin,et al. A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs[J]. ACTA MATERIALIA,2022,226.
APA	Wu，Xinzhi.,Han，Zhijia.,Zhu，Yongbin.,Deng，Biao.,Zhu，Kang.,...&Liu，Weishu.(2022).A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs.ACTA MATERIALIA,226.
MLA	Wu，Xinzhi,et al."A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs".ACTA MATERIALIA 226(2022).