题名 | Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography |
作者 | |
通讯作者 | Jiang, Youwei; Cheng, Xing |
发表日期 | 2019-02
|
DOI | |
发表期刊 | |
ISSN | 1996-1944
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卷号 | 12期号:3 |
摘要 | Thermoplastic polymer micro- and nanostructures suffer pattern decay when heated to a temperature close to or above the polymer's glass transition temperature. In this work, we report enhanced thermal stability of polycarbonate nanostructures at temperatures well above their glass transition temperatures. Based on this observation, we develop a unique technique for high-resolution polymer patterning by polymer reflows. This technique is characterized as the precise control of polymer reflows regardless of the annealing time, which avoids the time-domain nonlinear reflow of the polymer melt. We also implement thermal nanoimprinting in a step-and-repeat fashion, which dramatically increases the throughput of the thermal nanoimprint. The enhanced pattern stability against thermal reflow also allows for multiple imprinting at the same location to generate complex resist patterns from a simple mold structure. Since modern lithography often uses thin resist films (sub-100 nm) due to the restraint from the pattern aspect ratio, the unusual annealing behavior of thin polymer films is highly relevant in sub-100 nm lithographic processing. |
关键词 | |
相关链接 | [来源记录] |
收录类别 | |
语种 | 英语
|
学校署名 | 第一
; 通讯
|
资助项目 | Guangdong Innovative and Entrepreneurial Research Team Program[2016ZT06G587]
|
WOS研究方向 | Materials Science
|
WOS类目 | Materials Science, Multidisciplinary
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WOS记录号 | WOS:000460768000214
|
出版者 | |
EI入藏号 | 20190706513357
|
EI主题词 | Aspect Ratio
; Glass
; Glass Transition
; Nanoimprint Lithography
; Nanostructures
; Photoresists
; Polymer Melts
; Reinforced Plastics
; Temperature
; Thermodynamic Stability
; Time Domain Analysis
|
EI分类号 | Thermodynamics:641.1
; Semiconductor Devices And Integrated Circuits:714.2
; Nanotechnology:761
; Chemical Operations:802.3
; Glass:812.3
; Polymeric Materials:815.1
; Polymer Products:817.1
; Mathematics:921
; Solid State Physics:933
|
来源库 | Web of Science
|
引用统计 |
被引频次[WOS]:13
|
成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/26459 |
专题 | 前沿与交叉科学研究院 创新创业学院 工学院_材料科学与工程系 |
作者单位 | 1.Southern Univ Sci & Technol, SUSTech Acad Adv Interdisciplinary Studies, Shenzhen 518055, Peoples R China 2.Southern Univ Sci & Technol, Shenzhen Key Lab Nanoimprint Technol, Shenzhen 518055, Peoples R China 3.Southern Univ Sci & Technol, Sch Innovat & Entrepreneurship, Shenzhen 518055, Peoples R China 4.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China |
第一作者单位 | 前沿与交叉科学研究院; 南方科技大学 |
通讯作者单位 | 前沿与交叉科学研究院; 南方科技大学; 材料科学与工程系 |
第一作者的第一单位 | 前沿与交叉科学研究院 |
推荐引用方式 GB/T 7714 |
Jiang, Youwei,Luo, Bingqing,Cheng, Xing. Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography[J]. Materials,2019,12(3).
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APA |
Jiang, Youwei,Luo, Bingqing,&Cheng, Xing.(2019).Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography.Materials,12(3).
|
MLA |
Jiang, Youwei,et al."Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography".Materials 12.3(2019).
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条目包含的文件 | 条目无相关文件。 |
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