Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation

Meng, Binbin1,2; Yuan, Dandan1; Xu, Shaolin1

2019-02

10.1016/j.ijmecsci.2018.12.022

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES   影响因子和分区

0020-7403

1879-2162

To study the influence of strain rate and heat effect on the removal behavior of SiC, the dislocation nucleation/propagation, amorphization and abrasive wear behavior are analyzed in detail according to the mechanical response and temperature distribution in the machining region at different strain rate. The strain rate effect and the thermal softening effect directly affect the material removal amount and form of the subsurface damage. The study found that when the cutting speed reaches 50 m/s, the maximum material removal amount can be obtained. When the cutting speed reaches 150 m/s, the depth of the damaged layer reaches over 6 times of the residual processing depth. There is a large difference in the influence of the strain rate effect caused by the change in velocity on different types of dislocations. The stress component, scratch hardness, and hydrostatic pressure in the machining direction are continuously reduced as the cutting speed increases, and the thermal softening effect caused by the cutting heat is the main factor leading to this phenomenon. Abrasive wear behavior is the result of the coupling action of impact effect and grinding heat. When the cutting speed is 50 m/s, the minimum wear loss can be obtained.

SiC Strain rate effect Thermal softening Nano-scratching Deformation Slip

SCI ; EI

英语

第一 ; 通讯

Natural Science Foundation of Guangdong Province[2018A030310125]

Engineering ; Mechanics

Engineering, Mechanical ; Mechanics

WOS:000457951000056

PERGAMON-ELSEVIER SCIENCE LTD

20185206285489

Abrasion ; Abrasives ; Cutting ; Deformation ; Hydrostatic pressure ; Molecular dynamics ; Silicon carbide ; Silicon compounds

Abrasive Materials:606.1 ; Liquid Dynamics:631.1.1 ; Physical Chemistry:801.4 ; Inorganic Compounds:804.2 ; Materials Science:951

ENGINEERING

Web of Science

1.Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Peoples R China
2.Wuhan Univ, Sch Power & Mech Engn, Wuhan 430000, Hubei, Peoples R China

Meng, Binbin,Yuan, Dandan,Xu, Shaolin. Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation[J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,2019,151:724-732.

Meng, Binbin,Yuan, Dandan,&Xu, Shaolin.(2019).Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation.INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,151,724-732.

Meng, Binbin,et al."Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation".INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES 151(2019):724-732.