Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale

Meng, Binbin1,2; Yuan, Dandan1; Xu, Shaolin1

2019-02

10.1016/j.ceramint.2018.10.175

CERAMICS INTERNATIONAL   影响因子和分区

0272-8842

1873-3956

In this study, the influence mechanism of the coupling effect on the material removal process of SiC in nanoscale condition is investigated using the molecular dynamics method. The geometrical characteristics of a machined surface and the damage distribution under a coupling effect are analyzed. The influence law of the coupling effect on surface/subsurface features is also presented. According to the analysis results, the repeated and interference scratches with multi-abrasives, large-area machined surface morphology, and damage distribution are analyzed. This study is significant in understanding the removal mechanism of SiC during the grinding process at the nanoscale.

SiC Coupling effect Deformation Molecular dynamics

SCI ; EI

英语

第一 ; 通讯

Natural Science Foundation of Guangdong Province[2018A030310125]

Materials Science

Materials Science, Ceramics

WOS:000453492800126

ELSEVIER SCI LTD

20184305994685

Abrasives ; Deformation ; Grinding (machining) ; Molecular dynamics ; Nanotechnology ; Silicon carbide

Machining Operations:604.2 ; Nanotechnology:761 ; Physical Chemistry:801.4 ; Inorganic Compounds:804.2 ; Materials Science:951

MATERIALS SCIENCE

Web of Science

1.Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Peoples R China
2.Wuhan Univ, Sch Power & Mech Engn, Wuhan 430000, Hubei, Peoples R China

Meng, Binbin,Yuan, Dandan,Xu, Shaolin. Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale[J]. CERAMICS INTERNATIONAL,2019,45(2):2483-2491.

Meng, Binbin,Yuan, Dandan,&Xu, Shaolin.(2019).Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale.CERAMICS INTERNATIONAL,45(2),2483-2491.

Meng, Binbin,et al."Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale".CERAMICS INTERNATIONAL 45.2(2019):2483-2491.