High-performance conductive adhesives based on water-soluble resins for printed circuits, flexible conductive films, and electromagnetic interference shielding devices

Cao, Ge1; Cai, Shaoyong1; Zhang, He2; Tian, Yanqing1

2022

10.1007/s42114-021-00402-1

Advanced Composites and Hybrid Materials   影响因子和分区

2522-0128

2522-0136

Herein, we report high-performance electrically conductive adhesives (ECAs) as promising materials for flexible conductive films, printed circuits, and electromagnetic interference shielding devices. Through combining a small amount of water-dispersible polyaniline (PANI) nanorods and silver flakes into water-based polyurethane (WPU), the obtained ECAs showed high electrical conductivity with a low Ag content (4.8 x 10(4) S/cm, 60 wt% of silver, and 6% PANIs) and excellent stability; this stability withstood aging without change at 85 degrees C/65% RH for at least 20 days. Prototyped applications of the ECAs for flexible conductive films, printed circuits, and electromagnetic interference shielding devices were demonstrated. When these ECAs were used as flexible conductive films, these films exhibited excellent electrical performance under high mechanical deformation. The resistance of films remained unchanging after being bent with a 6-mm radius for over 8000 cycles, applied with 1000 kPa pressure, or stretched 20% for over 1000 cycles. The printed circuits had excellent flexibility and good adhesion on flexible substrates, enabling the circuits' stable operation at a high deformation. Moreover, novel conductive foams with high conductivity of 283.4 S/m and reasonable electromagnetic interference shielding effectiveness (EMI SE) of above 34 dB were obtained by integrating the ECAs with PU sponges to broaden the applications of ECAs. Therefore, this study provided an original, uncomplicated, low-price route to fabricate high-performance ECAs based on water-soluble resins for various flexible electronic devices.

Water-dispersible polyaniline Electrically conductive adhesives Flexible conductive films Printed circuits Electromagnetic interference shielding

SCI ; EI

英语

第一 ; 通讯

National Natural Science Foundation of China[21774054,21574061] ; Shenzhen fundamental research programs[JCYJ20170412152922553]

Science & Technology - Other Topics ; Materials Science

Nanoscience & Nanotechnology ; Materials Science, Composites

WOS:000744832500001

SPRINGERNATURE

Web of Science

1.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China
2.Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

Cao, Ge,Cai, Shaoyong,Zhang, He,et al. High-performance conductive adhesives based on water-soluble resins for printed circuits, flexible conductive films, and electromagnetic interference shielding devices[J]. Advanced Composites and Hybrid Materials,2022.

Cao, Ge,Cai, Shaoyong,Zhang, He,&Tian, Yanqing.(2022).High-performance conductive adhesives based on water-soluble resins for printed circuits, flexible conductive films, and electromagnetic interference shielding devices.Advanced Composites and Hybrid Materials.

Cao, Ge,et al."High-performance conductive adhesives based on water-soluble resins for printed circuits, flexible conductive films, and electromagnetic interference shielding devices".Advanced Composites and Hybrid Materials (2022).