Coalescence kinetics and microstructure evolution of Cu nanoparticles sintering on substrates: a molecular dynamics study

Liu，Xu1,2; Li，Shizhen2; Tan，Chunjian1,2; Gao，Chenshan2,3; Liu，Yang4; Ye，Huaiyu2,3; Zhang，Guoqi1

2022-03-01

10.1016/j.jmrt.2022.01.052

Journal of Materials Research and Technology-JMR&T   影响因子和分区

2238-7854

2214-0697

Nano copper sintering technology has great potential to be widely applied in the wide-bandgap semiconductor packaging. In order to investigate the coalescence kinetics of copper nano particles for this application, a molecular dynamic (MD) simulation was carried out at low temperature on a special model containing two substrate and multiple particles in between. Accordingly, thorough microstructure and dislocation investigation was conducted to identify the atomic-scale evolution in the system. The corresponding findings could provide evidence on the new particle-substrate sintering mechanism. Furthermore, atomic trajectories tracking method was applied to study the rotation behavior of different sized nano particles. New rotation behavior and mechanism were described. Additionally, the study on the size effect of copper particles on the sintering process and coalescence mechanism was conducted via comparing the microstructural and dislocation distribution of 3 nm, 4 nm and 5 nm models. Finally, by comparing the MSD results at low and high temperature for each model, the dominant coalescence dynamics changes were obtained.

Cu nanoparticle Microstructural analysis Molecular dynamics Sintering dynamics Sintering on substrate

SCI ; EI

英语

通讯

National Key R&D Program of China[2018YFE0204600] ; Shenzhen Fundamental Research Program[JCYJ20200109140822796]

Materials Science ; Metallurgy & Metallurgical Engineering

Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering

WOS:000796950400004

ELSEVIER

20220511567433

Coalescence ; Copper ; Molecular dynamics ; Nanoparticles ; Particle size analysis ; Rotation ; Sintering ; Temperature ; Wide band gap semiconductors

Copper:544.1 ; Thermodynamics:641.1 ; Semiconducting Materials:712.1 ; Nanotechnology:761 ; Colloid Chemistry:801.3 ; Physical Chemistry:801.4 ; Mechanics:931.1 ; Solid State Physics:933 ; Materials Science:951

2-s2.0-85123714426

Scopus

1.Department of Microelectronics,Delft University of Technology,Delft,2628 CD,Netherlands
2.School of Microelectronics,Southern University of Science and Technology,Shenzhen,518055,China
3.The Key Laboratory of Optoelectronic Technology & Systems,College of Optoelectronic Engineering,Education Ministry of China,Chongqing University,Chongqing,400044,China
4.School of Materials Science and Chemical Engineering,Harbin University of Science and Technology,Harbin,150040,China

Liu，Xu,Li，Shizhen,Tan，Chunjian,et al. Coalescence kinetics and microstructure evolution of Cu nanoparticles sintering on substrates: a molecular dynamics study[J]. Journal of Materials Research and Technology-JMR&T,2022,17:1132-1145.

Liu，Xu.,Li，Shizhen.,Tan，Chunjian.,Gao，Chenshan.,Liu，Yang.,...&Zhang，Guoqi.(2022).Coalescence kinetics and microstructure evolution of Cu nanoparticles sintering on substrates: a molecular dynamics study.Journal of Materials Research and Technology-JMR&T,17,1132-1145.

Liu，Xu,et al."Coalescence kinetics and microstructure evolution of Cu nanoparticles sintering on substrates: a molecular dynamics study".Journal of Materials Research and Technology-JMR&T 17(2022):1132-1145.