| 题名 | Abrasive-free polishing of tungsten alloy using electrochemical etching |
| 作者 | |
| 通讯作者 | Zhang, Xinquan |
| 发表日期 | 2017-09
|
| DOI | |
| 发表期刊 | |
| ISSN | 1388-2481
|
| EISSN | 1873-1902
|
| 卷号 | 82页码:80-84 |
| 摘要 | Tungsten alloy is a crucial engineering material for electrical and optical applications. However, damage-free and highly efficient polishing of tungsten has not been realized yet. We report the abrasive-free polishing of tungsten alloy using electrochemical polishing (ECP), which is an etching process. To achieve balance between polishing efficiency and surface quality, a two-step ECP process has been proposed. Current-driven ECP lasting for 3 min, as the first step, quickly removed the surface grinding marks and subsurface damage while the following potential-driven ECP lasted for 20 min, as the second step, improved the surface roughness and an ultra-smooth surface with an Ra roughness of 17.6 nm was finally obtained. |
| 关键词 | |
| 相关链接 | [来源记录] |
| 收录类别 | |
| 语种 | 英语
|
| 学校署名 | 第一
|
| WOS研究方向 | Electrochemistry
|
| WOS类目 | Electrochemistry
|
| WOS记录号 | WOS:000408359600018
|
| 出版者 | |
| EI入藏号 | 20173204019972
|
| EI主题词 | Abrasives
; Grinding (machining)
; Surface roughness
; Tungsten alloys
|
| EI分类号 | Tungsten and Alloys:543.5
; Machining Operations:604.2
; Abrasive Materials:606.1
; Physical Properties of Gases, Liquids and Solids:931.2
|
| ESI学科分类 | CHEMISTRY
|
| 来源库 | Web of Science
|
| 引用统计 |
被引频次[WOS]：15
|
| 成果类型 | 期刊论文 |
| 条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/28663 |
| 专题 | 工学院_机械与能源工程系 |
| 作者单位 | 1.Southern Univ Sci & Technol, Dept Mech & Energy Engn, 1088 Xueyuan Rd, Shenzhen 518055, Guangdong, Peoples R China 2.Singapore Inst Mfg Technol, 73 Nanyang Dr, Singapore 637662, Singapore |
| 第一作者单位 | 机械与能源工程系 |
| 第一作者的第一单位 | 机械与能源工程系 |
| 推荐引用方式 GB/T 7714 |
Deng, Hui,Huang, Rui,Liu, Kui,et al. Abrasive-free polishing of tungsten alloy using electrochemical etching[J]. ELECTROCHEMISTRY COMMUNICATIONS,2017,82:80-84.
|
| APA |
Deng, Hui,Huang, Rui,Liu, Kui,&Zhang, Xinquan.(2017).Abrasive-free polishing of tungsten alloy using electrochemical etching.ELECTROCHEMISTRY COMMUNICATIONS,82,80-84.
|
| MLA |
Deng, Hui,et al."Abrasive-free polishing of tungsten alloy using electrochemical etching".ELECTROCHEMISTRY COMMUNICATIONS 82(2017):80-84.
|
| 条目包含的文件 | ||||||
| 文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | 操作 | |
| Deng-2017-Abrasive-f（1043KB） | -- | -- | 限制开放 | -- | ||
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论