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题名

Molecular dynamics simulation on formation mechanism of grain boundary steps in micro-cutting of polycrystalline copper

作者
通讯作者Wang, Gang
发表日期
2017-01
DOI
发表期刊
ISSN
0927-0256
EISSN
1879-0801
卷号126页码:418-425
摘要
Three-dimensional molecular dynamics (MD) simulations were performed to investigate the formation mechanism of grain boundary (GB) steps in the micro-cutting of polycrystalline copper. The effects of the GB and misorientation angle on the surface quality were studied. Based on the simulation results, the surface maximum peak-to-valley height of polycrystalline copper was greater than that of single crystal copper owing to the formation of grain boundary steps. The dislocations continuously nucleated on the tool-workpiece interface were stopped and piled up at the GB. As the dislocations piled up at the GB, the dislocations became aligned and formed the sub-grain boundary to minimize the total system energy. Sub-grains with transitional crystal orientations formed at the GB during the micro-cutting of polycrystalline copper for the plowing of the cutting edge and crystal rotation. The misalignment in the slip directions between sub-grains and original grain resulted in the grain boundary step. A peak cutting force appeared at the GB in the cutting of polycrystalline owing to the geometrical hardening effects. It is revealed that the GB has a strong effect on the surface quality of a workpiece during the micro-cutting process. (C) 2016 Elsevier B.V. All rights reserved.
关键词
相关链接[来源记录]
收录类别
SCI ; EI
语种
英语
学校署名
其他
资助项目
Beijing Natural Science Foundation[3152013]
WOS研究方向
Materials Science
WOS类目
Materials Science, Multidisciplinary
WOS记录号
WOS:000389089900048
出版者
EI入藏号
20164402960195
EI主题词
Copper ; Crystal orientation ; Cutting tools ; Dislocations (crystals) ; Grain boundaries ; Micromachining ; Molecular dynamics ; Single crystals ; Surface properties
EI分类号
Copper:544.1 ; Machine Tool Accessories:603.2 ; Machining Operations:604.2 ; Physical Chemistry:801.4 ; Crystalline Solids:933.1 ; Crystal Lattice:933.1.1 ; Materials Science:951
ESI学科分类
MATERIALS SCIENCE
来源库
Web of Science
引用统计
被引频次[WOS]:27
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/29202
专题工学院_机械与能源工程系
作者单位
1.Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
2.Tsinghua Univ, Inst Mfg Engn, Dept Mech Engn, Beijing 100084, Peoples R China
3.Tsinghua Univ, Beijing Key Lab Precis Ultra Precis Mfg Equipment, Beijing 100084, Peoples R China
4.South Univ Sci & Technol China, Mech & Energy Engn Dept, Shenzhen 518055, Peoples R China
推荐引用方式
GB/T 7714
Liu, Dehao,Wang, Gang,Yu, Jianchao,et al. Molecular dynamics simulation on formation mechanism of grain boundary steps in micro-cutting of polycrystalline copper[J]. COMPUTATIONAL MATERIALS SCIENCE,2017,126:418-425.
APA
Liu, Dehao,Wang, Gang,Yu, Jianchao,&Rong, Yiming .(2017).Molecular dynamics simulation on formation mechanism of grain boundary steps in micro-cutting of polycrystalline copper.COMPUTATIONAL MATERIALS SCIENCE,126,418-425.
MLA
Liu, Dehao,et al."Molecular dynamics simulation on formation mechanism of grain boundary steps in micro-cutting of polycrystalline copper".COMPUTATIONAL MATERIALS SCIENCE 126(2017):418-425.
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