Sensitivity of polarized laser scattering detection to subsurface damage in ground silicon wafers

Yin，Jingfei1; Bai，Qian2; Zhang，Bi3

2022-06-15

10.1016/j.mssp.2022.106570

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING   影响因子和分区

1369-8001

Silicon is the primary substrate material in the semiconductor industry. Since surface integrity of a silicon wafer is crucial to the performance of an IC chip made of the wafer, the subsurface damage (SSD) induced by machining to a silicon wafer has been intensively investigated. However, detecting SSD is a challenge due to a lack of an effective method. This study presents a novel method, the polarized laser scattering (PLS) method, for detecting SSD in ground silicon wafers. A PLS system is established to detect the grinding-induced SSD which is also evaluated by the destructive methods. The study shows that the PLS signal is sensitive to the SSD depth with a detection resolution of approximately 0.1 μm. In addition, the detectability of the PLS method is demonstrated and a relationship between the PLS signal and SSD depth is established to facilitate the practical applications of the PLS method.

Grinding Polarized laser scattering Sensitivity Silicon wafer Subsurface damage

EI

英语

通讯

20220811703318

Damage detection ; Semiconductor lasers ; Silicon wafers ; Substrates

Machining Operations:604.2 ; Semiconductor Devices and Integrated Circuits:714.2 ; Semiconductor Lasers:744.4.1

MATERIALS SCIENCE

2-s2.0-85125011521

Scopus

1.College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing,210016,China
2.School of Mechanical Engineering,Dalian University of Technology,Dalian,116024,China
3.Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen,518055,China

Yin，Jingfei,Bai，Qian,Zhang，Bi. Sensitivity of polarized laser scattering detection to subsurface damage in ground silicon wafers[J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,144.

Yin，Jingfei,Bai，Qian,&Zhang，Bi.(2022).Sensitivity of polarized laser scattering detection to subsurface damage in ground silicon wafers.MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,144.

Yin，Jingfei,et al."Sensitivity of polarized laser scattering detection to subsurface damage in ground silicon wafers".MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 144(2022).