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题名

Analysis of Package Factors Affecting the Light Output Efficiency of Quantum Dots-Based Micro-LEDs

作者
DOI
发表日期
2021
会议名称
2021 IEEE 6th Optoelectronics Global Conference (OGC)
ISBN
978-1-6654-3195-8
会议录名称
页码
272-277
会议日期
15-18 Sept. 2021
会议地点
Shenzhen, China
出版地
345 E 47TH ST, NEW YORK, NY 10017 USA
出版者
摘要

As the demand for telecommuting, remote instruction, and non-contact testing increases, augmented reality (AR) and virtual reality (VR) are growing rapidly due to the ability to fulfill site constraints. The key component of AR/VR is the microsize light sources. Among various types of potential sources, light emitting diodes (micro-LEDs) are the one of the most promising candidates. Different packages have a significant impact on the light output characteristics of micro-LEDs, which in turn affects their application. In this work, Monte Carlo ray tracing method is used to study the luminous characteristics of quantum dots (QDs) based micro-LEDs in different package structures. The effects of various bank reflectance and tilt angle on the luminous characteristics are simulated to fit the different needs of practical applications. With the increase of reflectivity, the light efficiency is significantly improved, and the impact is the largest at the bank with the angle of 90°, where the light efficiency increases from 11.73% to 100%. The effect of QDs with different thickness and concentration on light efficiency was analyzed. The effect of QDs on light efficiency is not significant. However, owing to the formation of total internal reflection inside the micro-LED and the scattering characteristics of QDs, the absorption characteristics, which make the loss severe, semispherical micro-lens were added to break the total internal reflection at the light emitting interface and the light efficiency was increased by about 30%. This study will provide guidance for micro-LED packaging of different applications.

关键词
学校署名
其他
语种
英语
相关链接[Scopus记录]
收录类别
资助项目
National Key R&D Program of China[2019YFB1704600] ; National Natural Science Foundation of China[61905107] ; Shenzhen Innovation Project[JCYJ20190809152411655] ; characteristic innovation projects of colleges and universities in Guangdong province[2019KTSCX157]
WOS研究方向
Engineering ; Optics ; Imaging Science & Photographic Technology
WOS类目
Engineering, Electrical & Electronic ; Optics ; Imaging Science & Photographic Technology
WOS记录号
WOS:000838025000071
EI入藏号
20220711638994
EI主题词
Augmented reality ; Efficiency ; Microlenses ; Monte Carlo methods ; Nanocrystals ; Organic light emitting diodes (OLED) ; Quantum efficiency ; Ray tracing ; Reflection ; Refractive index ; Virtual reality
EI分类号
Semiconductor Devices and Integrated Circuits:714.2 ; Computer Software, Data Handling and Applications:723 ; Light/Optics:741.1 ; Optical Devices and Systems:741.3 ; Nanotechnology:761 ; Production Engineering:913.1 ; Mathematical Statistics:922.2 ; Quantum Theory; Quantum Mechanics:931.4 ; Crystalline Solids:933.1
Scopus记录号
2-s2.0-85124522732
来源库
Scopus
全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9654322
引用统计
被引频次[WOS]:0
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/328117
专题工学院_电子与电气工程系
作者单位
1.Shenzhen Technology University,College of New Materials and New Energies,Shenzhen,China
2.Southern University of Science and Technology,Department of Electrical and Electronic Engineering,Shenzhen,China
3.Shenzhen Institute of Information Technology,School of Electric Communication Technology,Shenzhen,China
推荐引用方式
GB/T 7714
Wu,Yuhao,Xie,Hairui,Zhang,Yuxuan,et al. Analysis of Package Factors Affecting the Light Output Efficiency of Quantum Dots-Based Micro-LEDs[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2021:272-277.
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Analysis_of_Package_(552KB)----限制开放--
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