Material removal thickness: a universal factor determining the evolution of surface roughness in electrochemical polishing

Ji, Jianwei1; Khan, Muhammad Ajmal2; Zhan, Zejin2; Yi, Rong2; Deng, Hui2

2022-04-01

10.1007/s00170-022-09129-9

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY   影响因子和分区

0268-3768

1433-3015

Electrochemical polishing (ECP) is widely used for scratch- and damage-free finishing of metal components. Though the polishing effect of ECP has been confirmed in many researches, the influence of polishing parameters on evolution of surface roughness is still ambiguous owing to the use of different ECP systems. In this paper, the universal factor determining the evolution of surface roughness during ECP is studied by theoretical analysis as well as experiments. Theoretical analysis based on viscous layer mechanism demonstrates that the material removal thickness is the key parameter governing the roughness evolution of the polished surface regardless of other parameters including the voltage and current and electrolyte concentration. A series of experiments were designed and carried out to verify the proposed hypothesis. Both the experimental results and already published researches proved the validity and universality of the newly developed hypothesis on surface roughness evolution. This work is of great significance for further understanding the finishing mechanism of ECP and process control for its practical applications.

Electrochemical polishing Tungsten Surface roughness Removed thickness Viscous layer

SCI ; EI

英语

第一 ; 通讯

National Natural Science Foundation of China[52035009,52005243] ; Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China[JCYJ20200109141003910]

Automation & Control Systems ; Engineering

Automation & Control Systems ; Engineering, Manufacturing

WOS:000777386900005

SPRINGER LONDON LTD

20221511937300

Electrolytes ; Polishing ; Tungsten

Tungsten and Alloys:543.5 ; Machining Operations:604.2 ; Electric Batteries and Fuel Cells:702 ; Chemical Agents and Basic Industrial Chemicals:803 ; Chemical Products Generally:804 ; Physical Properties of Gases, Liquids and Solids:931.2

ENGINEERING

Web of Science

1.Southern Univ Sci & Technol, Acad Adv Interdisciplinary Studies, 1088 Xueyuan Rd, Shenzhen 518055, Guangdong, Peoples R China
2.Southern Univ Sci & Technol, Dept Mech & Energy Engn, 1088 Xueyuan Rd, Shenzhen 518055, Guangdong, Peoples R China

Ji, Jianwei,Khan, Muhammad Ajmal,Zhan, Zejin,et al. Material removal thickness: a universal factor determining the evolution of surface roughness in electrochemical polishing[J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,120:5755-5762.

Ji, Jianwei,Khan, Muhammad Ajmal,Zhan, Zejin,Yi, Rong,&Deng, Hui.(2022).Material removal thickness: a universal factor determining the evolution of surface roughness in electrochemical polishing.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,120,5755-5762.

Ji, Jianwei,et al."Material removal thickness: a universal factor determining the evolution of surface roughness in electrochemical polishing".INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 120(2022):5755-5762.