Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

Li，Shizhen1; Liu，Xu1,2; Jiang，Jing3; Tan，Chunjian1,2; Gao，Chenshan1,4; Liu，Yang5; Ye，Huaiyu1,4; Zhang，Guoqi2

10.1109/EuroSimE54907.2022.9758874

2022

978-1-6654-5837-5

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

1-5

25-27 April 2022

St Julian, Malta

Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular dynamics simulation was applied to study the thickness effect on the thermal behavior of Cu-Ag CSNPs. The melting points of CSNPs and Pure NPs can be determined by the evolutions of Potential Energy (PE), and the Lindemann index (LI) of the system. The results indicated that the melting points of CS NPs were lower than monometallic NP and the melting point of CS NP is influenced by the size of the Cu core and the number of lattice mismatches. Moreover, the distribution of atoms' LI showed that the premelting point is independent of shell thickness. However, the fraction of atoms that occurred premelting is increased with the decrease of the shell thickness. Otherwise, we also simulated the sintering process of double CS NPs with equal size.

Nanoparticles Potential energy Silver Atomic layer deposition Stability criteria Sintering Thermal conductivity

第一 ; 通讯

英语

EI

20221912080341

Binary alloys ; Core shell nanoparticles ; Cost effectiveness ; Lattice mismatch ; Melting point ; Molecular dynamics ; Potential energy ; Sintering ; Thermodynamic stability

Structural Members and Shapes:408.2 ; Thermodynamics:641.1 ; Physical Chemistry:801.4 ; Industrial Economics:911.2 ; Physical Properties of Gases, Liquids and Solids:931.2 ; Crystal Lattice:933.1.1 ; Materials Science:951

2-s2.0-85129492592

Scopus

1.School of Microelectronics,Southern University of Science and Technology,Shenzhen,518055,China
2.Delft University of Technology,Department of Microelectronics,Delft,2628,Netherlands
3.Academy for EngineeringTechnology,Fudan University,Shanghai,200433,China
4.Key Laboratory of Optoelectronic Technology Systems,College of Optoelectronic Engineering,Education Ministry of China,Chongqing University,Chongqing,400044,China
5.School of Materials Science and Chemical Engineering,Harbin University of Science and Technology,Harbin,150040,China

Li，Shizhen,Liu，Xu,Jiang，Jing,et al. Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study[C],2022:1-5.