An 11.6aF/kPa Mechanical Stress Sensor with 0.808% Temperature-drift Oscillator for Flip-chip Packaging

Xiao，Lanxiang1; Chen，Lei2; An，Fengwei3

2023-02

10.1109/TCSII.2022.3176278

IEEE Transactions on Circuits and Systems II: Express Briefs   影响因子和分区

1558-3791

Package Thermal And Mechanical Stresses Temperature-compensation RC Oscillator Circuit Sensitivity.

SCI ; EI

英语

第一 ; 通讯

WOS:000965412300001

20222112149897

Chip Scale Packages ; Flip Chip Devices ; Metals ; MIM Devices ; Oscillators (Electronic) ; Stress Measurement ; Temperature Distribution ; Temperature Sensors ; Timing Circuits

Thermodynamics:641.1 ; Oscillators:713.2 ; Pulse Circuits:713.4 ; Semiconductor Devices And Integrated Circuits:714.2 ; Mechanical Variables Measurements:943.2 ; Temperature Measuring Instruments:944.5 ; Temperature Measurements:944.6

IEEE

1.School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, China and School of Microelectronics, Southern University of Science and Technology, Shenzhen, China
2.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China
3.School of Microelectronics, Southern University of Science and Technology and Engineering Research Center of Integrated Circuits for Next-Generation Communications, Ministry of Education, Southern University of Science and Technology, China

Xiao，Lanxiang,Chen，Lei,An，Fengwei. An 11.6aF/kPa Mechanical Stress Sensor with 0.808% Temperature-drift Oscillator for Flip-chip Packaging[J]. IEEE Transactions on Circuits and Systems II: Express Briefs,2023,70(2):391-395.

Xiao，Lanxiang,Chen，Lei,&An，Fengwei.(2023).An 11.6aF/kPa Mechanical Stress Sensor with 0.808% Temperature-drift Oscillator for Flip-chip Packaging.IEEE Transactions on Circuits and Systems II: Express Briefs,70(2),391-395.

Xiao，Lanxiang,et al."An 11.6aF/kPa Mechanical Stress Sensor with 0.808% Temperature-drift Oscillator for Flip-chip Packaging".IEEE Transactions on Circuits and Systems II: Express Briefs 70.2(2023):391-395.