基于墨水直写的软材料3D打印及其应用

软材料具有激励小、变形大的特点，在日常生活和工程领域中均具有广泛的应用。3D打印技术的发展为软材料提供了智能制造的平台。墨水直写打印是软材料打印中最为常见的一种，具有结构简单、成本低廉、适用性强等优点，被广泛应用于打印各种功能性软材料。墨水直写打印要求墨水材料具有较高的粘度（10^-1-10³ Pa·s），同时具有剪切变稀特性。但是，大多数软材料的前驱液不能同时满足这两种性质。尽管可以通过调节化学组分优化墨水材料的流变性能，从而提高可打印性，但优化过程往往牺牲了材料在力学、光学和生物相容性等方面的性能。因此，传统的墨水直写打印技术在很大程度上限制了材料的选择范围。

针对上述问题，本课题发展了一种与稀溶液兼容的打印技术，通过等离子体处理技术与墨水直写技术的集成，在不改变材料组分的前提下，实现了基于墨水直写的等离子体辅助软材料3D打印。在硬件方面，对相关零部件进行选型、建模、制造和装配，设计并搭建了能够同时完成墨水直写打印和等离子体处理的打印平台。在材料方面，开发了适用于该墨水直写打印技术的材料，并通过参数优化得到了最佳打印精度；对该打印技术墨水材料在基板表面铺开的力学机理进行了分析，并进一步探究了该技术对墨水材料和基板类型的普适性，测试了不同类型材料在不同类型基板表面的粘接能。在应用方面，探究了墨水直写3D打印的水凝胶作为离子导体的电学性能，设计并制备了离子导体驱动的柔性薄膜电致发光器件和适用于软体驱动器的柔性大变形应变传感器。

本文提出的基于墨水直写的等离子体辅助软材料3D打印技术，解决了目前普遍存在的墨水直写打印技术与低粘度墨水材料不兼容的问题，将可打印墨水的最低粘度降低了两个数量级（10^-3 Pa·s），极大地拓宽了墨水材料的选择范围，为墨水直写3D打印技术提供了新的解决方案。

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