一种晶圆减薄装置

本实用新型涉及晶圆厚度减薄技术领域，公开了一种晶圆减薄装置，包括电源与工具电极，所述电源的一极与所述工具电极电连接，所述电源的另一极能够与待加工的晶圆电连接，所述工具电极上设有多个放电端子。本实用新型运用电火花加工的原理，通过将工具电极和晶圆分别连接电源两极，然后依靠电压击穿工具电极和晶圆间的间隙，在工具电极和晶圆间形成放电通道，进而对放电通道位置的晶圆表面进行减薄，整个过程属于非接触型加工，工具电极和晶圆间没有接触作用力，晶圆没有接触力过大而破碎的风险。

The utility model relates to the technical field of wafer thickness reduction, and discloses a wafer thickness reduction device, which comprises a power supply and a tool electrode, one electrode of the power supply is electrically connected with the tool electrode, the other electrode of the power supply can be electrically connected with a wafer to be processed, and a plurality of discharge terminals are arranged on the tool electrode. According to the utility model, based on the principle of electric spark machining, the tool electrode and the wafer are respectively connected with the two poles of the power supply, and then a discharge channel is formed between the tool electrode and the wafer by means of voltage breakdown, so that the surface of the wafer at the position of the discharge channel is thinned, and the whole process belongs to non-contact machining. No contact acting force exists between the tool electrode and the wafer, and the wafer has no risk of being broken due tooverlarge contact force.