基于结构函数法的多层材料热物性参数解析的时域问题研究

       随着摩尔定律演进，电路元器件已逐步接近其物理极限，功耗和性能优势随之下降，而三维集成封装能够缩短互联，成为缓解微缩问题的重要发展趋势，然而三维堆叠结构发热量剧增的同时，其散热面积并未相应增加，导致系统热管理问题凸显，散热性能测试和热物性参数解析成为了亟待解决的问题。本研究基于结构函数方法，从热网络和电网络的本质差异出发，对传热机理和网络转换理论展开研究，并由此引出算法层面存在的时序丢失问题和时延偏差问题，初步解决了样品解析时相同或相似材料层无法区分的缺陷，提出逐层解析法校准了时延导致的热阻解析偏差，并给出热流路径重构方法。
       在传热机理部分，基于传热学理论设计了纵向温度场分布的非接触瞬态热测试系统，引入热波前概念阐释传热机理，认为随热波前的传递，一维热响应包含热波所覆盖区域的热物性参数信息，依据物理响应机理引出了时序和时延两个问题。在网络转换研究中，梳理了两种网络模型的物理意义，认为CAUER模型的接地处理更适合系统热物性参数的刻画。
       在时序问题部分，本研究发现原算法在反卷积步骤之后丢失时序信息，这会导致样品重构失真，且无法得到热流路径信息。本研究从算法分析入手，给出了时序丢失的原因阐述，并提出了两种时域标记方法，分别基于二阶微分和小波多尺度时频分析，初步解析结果说明该方法能够在反卷积步骤之前保留时序信息。
       在时延问题部分，本研究基于传热机理，提出多层结构中热响应较之电响应，存在更为明显的时延情况。首先通过实验数据验证了时延问题的存在，其热阻解析偏差约为29.23 %。进而通过数值实验定量研究了时延与样品热时间常数的关系对解析偏差的影响，认为随着时延的增大，样品总热阻不变，但各层热阻解析偏差增大。对于热阻本身较小的样品层，热阻偏差尤为明显，甚至达到57 %。针对该问题，本研究提出基于小波时域标记的单层重构解析算法，在保留时序信息的基础上，通过单层重构算法，逐层消除时延影响，解析得到热物性参数信息。本部分以具有重复结构的四层样品为例进行解析，初步所得结果较为准确，数值比例吻合较好，但由于重构过程中存在误差累积，该算法仍需要进一步优化。

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