中文版 | English
题名

Study of Mass Transfer for Micro-LED Manufacturing†

作者
通讯作者Liu,Zhaojun
DOI
发表日期
2019
ISSN
0097-966X
EISSN
2168-0159
会议录名称
卷号
50
期号
S1
页码
775-778
摘要
Micro-LED is superior to LCD and OLED in terms of power consumption, light efficiency, contrast, response time, reliability, color gamut, lifetime, resolution and viewing angle, it is regarded as the most promising display technology in next generation. However, there are still many technical bottlenecks that hinder the development of Micro-LED display. One of the most important technical issues is mass transfer. Mass transfer is a technology aim to transferring millions or even tens of millions of Micro-LED pixels which grown on sapphire substrates to the glass substrates required for display devices quickly and correctly and providing good electrical and mechanical connections between the Micro-LED pixels and the drive circuits. There have been many companies that have been working to solve this problem and have come up with solutions from different technical aspects. In this paper, we will review several different technologies, classify them from the technical type, evaluate the maturity and achievability of the technology, and analyze the application fields of different technologies.
关键词
学校署名
第一 ; 通讯
语种
英语
相关链接[Scopus记录]
收录类别
EI入藏号
20222912373285
EI主题词
Energy efficiency ; Light emitting diodes ; Liquid crystal displays ; Mass transfer ; Pixels ; Sapphire ; Substrates
EI分类号
Gems:482.2.1 ; Energy Conservation:525.2 ; Mass Transfer:641.3 ; Semiconductor Devices and Integrated Circuits:714.2 ; Physical Chemistry:801.4 ; Atomic and Molecular Physics:931.3
Scopus记录号
2-s2.0-85114492266
来源库
Scopus
引用统计
被引频次[WOS]:0
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/356254
专题工学院_电子与电气工程系
作者单位
Department of Electrical and Electronic Engineering,Southern University of Science and Technology,Shenzhen,China
第一作者单位电子与电气工程系
通讯作者单位电子与电气工程系
第一作者的第一单位电子与电气工程系
推荐引用方式
GB/T 7714
Liu,Xinyi,Tong,Caiyu,Luo,Xiongshi,等. Study of Mass Transfer for Micro-LED Manufacturing†[C],2019:775-778.
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