题名 | Bistructural Pseudocontinuous Solid Solution with Hierarchical Microstructures from Ab initio Study: Application to the Mg2Sn-Mg3Sb2 System |
作者 | |
通讯作者 | Zhang, Wenqing |
发表日期 | 2022-09-01
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DOI | |
发表期刊 | |
ISSN | 1359-6454
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EISSN | 1873-2453
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卷号 | 236 |
摘要 | Hetero-structural solid solutions, i.e. those from the parent compounds with different crystal structures, occasionally appear for exploring new materials, but a systematic understanding of the thermodynamics, microstructures and electronic characteristics is still lacking. By alloying cubic (1-x)Mg2Sn with hexagonal (0.5x)Mg3Sb2, we show that such a system manifests an overall pseudocontinuous composition distribution with hierarchical microstructures, and the coexistence of n-type/p-type electronic conduction regions. This type of solid solution is defined as a bistructural pseudocontinuous solid solution (BiSS), clearly different from the homogenous iso-structural solid solutions. The Mg2-0.5xSn1-xSbx phase is found to be stable at the Mg2Sn-based phase only in the range of 0 < x <= similar to 0.47, consistent with experimental observations. Large-scale Monte Carlo simulations reveal the natural occurrence of hierarchical microstructures, which contains primarily both nanoscale Mg-deficiency clusters and a homogeneous matrix showing tunable compositions relevant to alloy composition and annealing temperature. The electronic structures of the BiSS thus manifest a spatially inhomogeneous coexistence of n-type matrix and p-type nanoclusters, implying the importance of selective doping for optimizing thermoelectric performance. Those phenomena could be considered universal in hetero-structural solid solutions. This work offers a general guideline for the design of bistructural and even hetero-structural solid solutions with potential novel functionality. (C) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
关键词 | |
相关链接 | [来源记录] |
收录类别 | |
语种 | 英语
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学校署名 | 通讯
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资助项目 | National Key R&D Program of China[2019YFA0704901]
; Natural Science Foundation of China["92163212","51872133"]
; Shenzhen Municipal Key-Lab program[ZDSYS20190902092905285]
; Guangdong Provincial Key Laboratory of Computational Science and Material Design[2019B030301001]
; Guangdong Innovation Research Team Project[2017ZT07C062]
; Natural Science Foundation of China Program[51872133]
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WOS研究方向 | Materials Science
; Metallurgy & Metallurgical Engineering
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WOS类目 | Materials Science, Multidisciplinary
; Metallurgy & Metallurgical Engineering
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WOS记录号 | WOS:000838025900001
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出版者 | |
ESI学科分类 | MATERIALS SCIENCE
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来源库 | Web of Science
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引用统计 |
被引频次[WOS]:3
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成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/382311 |
专题 | 理学院_物理系 工学院_材料科学与工程系 |
作者单位 | 1.Harbin Inst Technol, Harbin 150080, Peoples R China 2.Southern Univ Sci & Technol, Dept Phys, Shenzhen 518055, Peoples R China 3.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China 4.Cent South Univ Forestry & Technol, Hunan Prov Key Lab Mat Surface Interface Sci & Tec, Changsha 410004, Peoples R China 5.Cent South Univ, Powder Met Res Inst, Changsha 410083, Peoples R China 6.Southern Univ Sci & Technol, Shenzhen Municipal Key Lab Adv Quantum Mat & Devic, Shenzhen 518055, Guangdong, Peoples R China 7.Southern Univ Sci & Technol, Guangdong Prov Key Lab Computat Sci & Mat Design, Shenzhen 518055, Guangdong, Peoples R China |
第一作者单位 | 物理系 |
通讯作者单位 | 材料科学与工程系; 南方科技大学 |
推荐引用方式 GB/T 7714 |
Dong, Erting,Zhu, Yongbin,Tan, Shihua,et al. Bistructural Pseudocontinuous Solid Solution with Hierarchical Microstructures from Ab initio Study: Application to the Mg2Sn-Mg3Sb2 System[J]. ACTA MATERIALIA,2022,236.
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APA |
Dong, Erting,Zhu, Yongbin,Tan, Shihua,Liu, Weishu,Wang, Jiong,&Zhang, Wenqing.(2022).Bistructural Pseudocontinuous Solid Solution with Hierarchical Microstructures from Ab initio Study: Application to the Mg2Sn-Mg3Sb2 System.ACTA MATERIALIA,236.
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MLA |
Dong, Erting,et al."Bistructural Pseudocontinuous Solid Solution with Hierarchical Microstructures from Ab initio Study: Application to the Mg2Sn-Mg3Sb2 System".ACTA MATERIALIA 236(2022).
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