非均质浆料的整流挤出及其在导热垫片制备中的应用

RECTIFICATION EXTRUSION OF HETEROGENEOUS SLURRY AND ITS APPLICATION IN THE PREPARATION OF THERMAL CONDUCTIVITY PAD

迟克禹

11749172

硕士

材料工程

祝渊

2019-05-31

2019-06-28

哈尔滨工业大学

深圳

近年来，随着电子元件不断地向小型化、集成化、大功率化方向发展，在其使用功能和性能都不断提高的同时，功耗和发热量也随之持续增加。电子元器件的温度每升高10 ℃，其可靠性下降50%，由此可见，散热问题已成为制约电子技术高速发展的重要瓶颈问题。为了有效解决散热问题，学术界和工业界都投入了大量的精力去研究，目前已逐渐发展成为一门涉及散热设备、散热方式、散热材料等方面的新兴学科—热管理（Thermal Management）学科。现在主流的电子元件散热方式是风扇散热，即在高功率电子元件上安装外加风扇，而刚性接触的电子元件和风扇之间并不是完美贴合的平面，存在大量的空气间隙，低热导率的空气使风扇的散热效果变差，所以用于填补两者间隙的热界面材料应运而生，导热垫片是热界面材料的一种并且拥有几十亿人民币的市场份额。本课题从微观及宏观两方面出发研究了高导热垫片的制备方法，微观方面主要研究了偶联剂对非均质浆料的界面改性，降低浆料粘度，提高粉体填充量以及增强粉体和基体的连接，并发现正癸基三甲氧基硅烷使用量为2.5%时，最多可使粘度下降43%，此外，预处理法对导热垫片热导率的提升效果最明显，最高可提升14.1%。宏观方面主要研究了碳纳米管作为导热粉体在导热垫片中的影响规律及各向异性导热粉体和液态高分子基体组成非均质浆料在整流挤出时碳纳米管的定向排列效果并探究了高导热垫片制备的具体工艺条件，并发现当碳纳米管长度10 μm、直径30-80 nm、质量分数为5%时，采用整流挤出工艺制备的导热垫片纵向热导率可达1.53 W∙m-1K-1是横向热导率的2.15倍，通过偶联剂改性碳纳米管可进一步提高导热垫片的热导率，达到2.03 W∙m-1K-1。

In recent years, with the development of electronic components in the direction of miniaturization, integration and high-power, their functions and performances are constantly improved, while power consumption and calorific value also continue to increase. The reliability of electronic components decreases by 10% when the temperature of electronic components rises by 2 ℃. It can be seen that heat dissipation has become an important bottleneck restricting the rapid development of electronic technology. In order to effectively solve the problem of heat dissipation, both academia and industry have devoted a lot of energy to research. At present, it has gradually developed into a new discipline - Thermal Management, which involves heat dissipation equipment, heat dissipation methods, heat dissipation materials and so on.Nowadays, the mainstream way of heat dissipation of electronic components is fan heat dissipation, that is, installing additional fans on high-power electronic components, while the rigid contact between electronic components and fans is not a perfect fit plane, there are a lot of air gap, low thermal conductivity air makes the cooling effect of fans worse, so the thermal interface materials used to fill the gap between the two come into being. Thermal interface materials have a market share of billions.The preparation methods of high thermal conductivity gaskets were studied from both micro and macro aspects. In micro aspect, the interfacial modification of heterogeneous slurry by coupling agent was studied. The slurry viscosity was reduced, the filling content of powder was increased, and the connection between powder and matrix was enhanced. It was found that the viscosity could be reduced by 43% at most when the use rate of n-Decyltrimethoxysilane was 2.5%. In addition, the pretreatment method was used. The thermal conductivity of heat conductive gasket can be increased by 14.1%. Macroscopically, the influence of carbon nanotubes as thermal conductive powders on thermal conductive gaskets and the directional alignment effect of heterogeneous slurries composed of anisotropic thermal conductive powders and liquid polymer matrix during rectification extrusion were studied. The specific technological conditions for preparing high thermal conductive gaskets were also explored. It was found that when the length of carbon nanotubes was 10μm, the diameter was 30-80nm, and the mass fraction was 5%, the carbon nanotubes were extracted. The longitudinal thermal conductivity of the heat conducting gasket prepared by rectifying extrusion process is 1.53 W∙m-1K-1, which is 2.15 times of the transverse thermal conductivity. The thermal conductivity of the heat conducting gasket can be further improved by modifying carbon nanotubes with coupling agent, reaching 2.03 W∙m-1K-1.

导热垫片 偶联剂改性 非均质浆料 整流挤出

thermally conductive pad coupling agent modification heterogeneous slurry rectifier extrusion

中文

联合培养

南方科技大学

迟克禹. 非均质浆料的整流挤出及其在导热垫片制备中的应用[D]. 深圳. 哈尔滨工业大学,2019.