一种刮涂组件及刮涂设备

本发明公开了一种刮涂组件及刮涂设备，包括：第一盖板；刷头，所述刷头与所述第一盖板可拆卸连接，且所述刷头的一端设有齿状结构；以及第二盖板，所述第二盖板与所述第一盖板可拆卸连接，并将所述刷头夹持在所述第一盖板和所述第二盖板之间，使所述齿状结构从所述第一盖板和所述第二盖板之间伸出，所述刮涂组件通过所述齿状结构输出溶液铺展成膜。本发明所述刮涂组件通过所述齿状结构输出溶液铺展成膜，能够产生强剪切流，制备出光电性能良好的半导体薄膜；同时可以连续制备大面积薄膜，适用于柔性和曲面基底，并且材料利用率高，能够有效减少薄膜制备过程中对溶液的浪费。

The invention discloses a blade coating assembly and blade coating equipment. The blade coating assembly comprises a first cover plate; the brush head is detachably connected with the first cover plate, and one end of the brush head is provided with a tooth-shaped structure; and the second cover plate is detachably connected with the first cover plate, the brush head is clamped between the first cover plate and the second cover plate, so that the tooth-shaped structure extends out of the space between the first cover plate and the second cover plate, and the blade coating assembly outputs a solution through the tooth-shaped structure and spreads the solution into a film. According to the blade coating assembly, a solution is output through the tooth-shaped structure and spread to form a film, a strong shear flow can be generated, and a semiconductor film with good photoelectric performance is prepared; meanwhile, large-area films can be continuously prepared, the method is suitable for flexible and curved-surface substrates, the material utilization rate is high, and waste of solutions in the film preparation process can be effectively reduced.