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题名

A TCAD Simulation Study on the Short-circuit Performance of 650V P-pillar Offset Super-junction MOSFET

作者
通讯作者Huaiyu Ye
DOI
发表日期
2022
会议名称
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
ISBN
978-1-6654-9906-4
会议录名称
页码
1-4
会议日期
10-13 Aug. 2022
会议地点
Dalian, China
摘要
The limitation of Silicon based power MOSFET was broken by the super-junction (SJ) structure, which can provide lower specific on-resistance and higher breakdown voltage compared with the conventional power MOSFET structure. Multi-epitaxial and multi-ion-implant technology, as a mature manufacturing process of the SJ structure, has been widely used in the field of SJ-MOSFET. Therefore, this process is applied to construct the cell structure of 650V SJ-MOSFET in our study. Based on practical application, high current caused by unexpected short circuit will induce an increasing of the internal temperature of SJ-MOSFET, which leads to an irreversible damage in the SJ-MOSFET devices. However, the short-circuit robustness of SJ-MOSFET is still unstable, and the structure needs to be further improved. In our study, the electrical performance of a 650V SJ-MOSFET with offset P-pillar is theoretically investigated by means of technology computer aided design (TCAD) when the SJ-MOSFET is short circuited. The results clearly show that the optimized SJ-MOSFET can withstand the source-drain voltage of 400V for at least 10 μs in the case of the short-circuit. The thermal distribution and peak temperature of the cell structure of SJ-MOSFET are also simulated to assist in the analysis of the short circuit capable of the device. In addition, the hole current density distribution of two SJ-MOSFETs is considered to gain insight into the effect of P-pillar parameters on the short-circuit robustness. The result represents that the structure with offset P-pillar can effectively improve the short-circuit capability.
关键词
学校署名
第一 ; 通讯
相关链接[IEEE记录]
来源库
IEEE
全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9873366
引用统计
被引频次[WOS]:1
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/401526
专题南方科技大学
工学院_深港微电子学院
作者单位
1.School of Microelectronic, Southern University of Science and Technology, Shenzhen, China
2.Fac.EEMCS Delft University of Technology Delft, Netherlands
第一作者单位南方科技大学
通讯作者单位南方科技大学
第一作者的第一单位南方科技大学
推荐引用方式
GB/T 7714
Wucheng Yuan,Ke Liu,Shaogang Wang,et al. A TCAD Simulation Study on the Short-circuit Performance of 650V P-pillar Offset Super-junction MOSFET[C],2022:1-4.
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