Fracture Toughness Characterization of Thin Films Based on Finite Element Assisted Nanoindentation Technique

Weiquan Luo1; Weijing Dai2; Cheng Chen2; Zhiqi Wang3; Yanxin Wang3; Yijing Qin2; Ke Xue1; Dong Lu2

10.1109/ICEPT56209.2022.9873209

2022

978-1-6654-9906-4

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

1-5

10-13 Aug. 2022

Dalian, China

The material properties of thin films are of great importance for understanding the failure mechanisms of electronic devices. However, traditional test methods can not meet the requirements of characterizing thin films in micron scale, , especially with the development of higher integration of electronic packaging technology in 5G era. In this study, we provide a methodological and theoretical reference for characterizing the fracture toughness of thin films using nanoindentation technique and finite element (FE) modelling methodology. Nanoindentation technique was used to characterize the fracture toughness of the passivation layer films. The mechanical properties of the silicon nitride film were further investigated based on the FE model. The load displacement curve and cracks obtained from the simulation are in satisfactory agreement with measurements.

thin film nanoindentation finite element analysis fracture toughness

第一

IEEE

1.School of System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen, China
2.Center for Engineering Materials and Reliability, Guangzhou HKUST Fok Ying Tung Research Institute, Guangzhou, China
3.Monolithic Power System, Chengdu, China

Weiquan Luo,Weijing Dai,Cheng Chen,et al. Fracture Toughness Characterization of Thin Films Based on Finite Element Assisted Nanoindentation Technique[C],2022:1-5.