Research on Diode Product Reliability of FOPLP Based on PCB Process

Jing Jiang1; Chenshan Gao2; Jia Ren Huo2; Guoqi Zhang3; Jun Li4; Yuhong Li2; Guanqiang Song2; Jiajie Fan3; Huaiyu Ye5

10.1109/ICEPT56209.2022.9873112

2022

978-1-6654-9906-4

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

1-5

10-13 Aug. 2022

Dalian, China

FOPLP (Fan-out Panel level Packaging) plan is a new packaging plan, which has the characteristics of high utilization, low cost and high electrical efficiency, and is a cutting-edge packaging method. Transient voltage suppression diode is mainly used for fast overvoltage protection of circuit components. It works in a normally closed state, and its reliability mainly considers the comprehensive action of environmental temperature, humidity and electrical stress. H3TRB (High Temperature Reverse Bias)test is to evaluate the device for a long time by applying temperature, humidity and voltage stress, so as to simulate the long-term operation life of the device and meet the working environment requirements of TVS(Transient Voltage Suppressor) devices. Most of the research on H3TRB industry mainly focus on the traditional wiring plan, and the research on moisture based on FOPLP plan is less. Therefore, this paper mainly studies the leakage problem of TVS package made under FOPLP plan in the process of moisture reliability test. Through relevant mechanism research and failure analysis, it is found that blind hole deviation is the main cause of failure, which leads to ECM(Electrochemical Migration)phenomenon in H3RTB process. By controlling the deviation of blind holes, the sample meets the reliability requirements of H3TRB 500H products, which provides a reference for improving the moisture reliability requirements of FOPLP plan.

FOPLP electric leakage the offset of chip mounting location H3TRB

其他

IEEE

1.Sky Chip Interconnection Technology CO., LTD, Shenzhen, China
2.Product Research and Development, Sky Chip Interconnection Technology CO., LTD, Shenzhen, China
3.Academy for Engineering & Technology, Fudan University, Shanghai, China
4.Pingxi Preparatory Group University, Sky Chip Interconnection Technology co., LTD, Shenzhen, China
5.Chongqing University, Southern University of Science and Technology, Shenzhen, China

Jing Jiang,Chenshan Gao,Jia Ren Huo,et al. Research on Diode Product Reliability of FOPLP Based on PCB Process[C],2022:1-5.