题名 | AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics |
作者 | |
通讯作者 | Xia, Jianfei; Li, Baowen; Sun, Bin |
发表日期 | 2022-09-01
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DOI | |
发表期刊 | |
ISSN | 1944-8244
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EISSN | 1944-8252
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摘要 | Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 +/- 1 degrees C (10.5 degrees C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPUBNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density. |
关键词 | |
相关链接 | [来源记录] |
收录类别 | |
语种 | 英语
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学校署名 | 通讯
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资助项目 | Natural Science Foundation of Shandong Province[ZR2020ME193]
; Shandong Natural Science Funds for Distinguished Young Scholar[ZR2020JQ20]
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WOS研究方向 | Science & Technology - Other Topics
; Materials Science
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WOS类目 | Nanoscience & Nanotechnology
; Materials Science, Multidisciplinary
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WOS记录号 | WOS:000851037900001
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出版者 | |
来源库 | Web of Science
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引用统计 |
被引频次[WOS]:14
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成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/401574 |
专题 | 理学院_物理系 量子科学与工程研究院 工学院_材料科学与工程系 |
作者单位 | 1.Qingdao Univ, Coll Phys, Qingdao 266071, Peoples R China 2.Qingdao Univ, Coll Elect & Informat, Qingdao 266071, Peoples R China 3.Maanshan Univ, Dept Basic, Maanshan 243100, Peoples R China 4.Southern Univ Sci & Technol, Shenzhen Inst Quantum Sci & Engn, Dept Mat Sci & Engn, Dept Phys, R China, Shenzhen 518055, Peoples R China 5.Qingdao Univ, Instrumental Anal Ctr, Coll Chem & Chem Engn, Shandong Sino Japanese Ctr Collaborat Res Carbon N, Qingdao 266071, Peoples R China 6.Qingdao Univ, Weihai Innovat Res Inst, Weihai 264200, Peoples R China 7.Univ Colorado, Paul M Rady Dept Mech Engn, Boulder, CO 80305 USA 8.Univ Colorado, Dept Phys, Boulder, CO 80305 USA |
通讯作者单位 | 物理系; 材料科学与工程系; 量子科学与工程研究院 |
推荐引用方式 GB/T 7714 |
Wang, Qiaoli,Li, Tianshuo,Ding, Yafei,et al. AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics[J]. ACS Applied Materials & Interfaces,2022.
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APA |
Wang, Qiaoli.,Li, Tianshuo.,Ding, Yafei.,Chen, Huibao.,Cao, Xiyue.,...&Sun, Bin.(2022).AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics.ACS Applied Materials & Interfaces.
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MLA |
Wang, Qiaoli,et al."AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics".ACS Applied Materials & Interfaces (2022).
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条目包含的文件 | 条目无相关文件。 |
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