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题名

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

作者
通讯作者Xia, Jianfei; Li, Baowen; Sun, Bin
发表日期
2022-09-01
DOI
发表期刊
ISSN
1944-8244
EISSN
1944-8252
摘要
Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 +/- 1 degrees C (10.5 degrees C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPUBNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.
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语种
英语
学校署名
通讯
资助项目
Natural Science Foundation of Shandong Province[ZR2020ME193] ; Shandong Natural Science Funds for Distinguished Young Scholar[ZR2020JQ20]
WOS研究方向
Science & Technology - Other Topics ; Materials Science
WOS类目
Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS记录号
WOS:000851037900001
出版者
来源库
Web of Science
引用统计
被引频次[WOS]:14
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/401574
专题理学院_物理系
量子科学与工程研究院
工学院_材料科学与工程系
作者单位
1.Qingdao Univ, Coll Phys, Qingdao 266071, Peoples R China
2.Qingdao Univ, Coll Elect & Informat, Qingdao 266071, Peoples R China
3.Maanshan Univ, Dept Basic, Maanshan 243100, Peoples R China
4.Southern Univ Sci & Technol, Shenzhen Inst Quantum Sci & Engn, Dept Mat Sci & Engn, Dept Phys, R China, Shenzhen 518055, Peoples R China
5.Qingdao Univ, Instrumental Anal Ctr, Coll Chem & Chem Engn, Shandong Sino Japanese Ctr Collaborat Res Carbon N, Qingdao 266071, Peoples R China
6.Qingdao Univ, Weihai Innovat Res Inst, Weihai 264200, Peoples R China
7.Univ Colorado, Paul M Rady Dept Mech Engn, Boulder, CO 80305 USA
8.Univ Colorado, Dept Phys, Boulder, CO 80305 USA
通讯作者单位物理系;  材料科学与工程系;  量子科学与工程研究院
推荐引用方式
GB/T 7714
Wang, Qiaoli,Li, Tianshuo,Ding, Yafei,et al. AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics[J]. ACS Applied Materials & Interfaces,2022.
APA
Wang, Qiaoli.,Li, Tianshuo.,Ding, Yafei.,Chen, Huibao.,Cao, Xiyue.,...&Sun, Bin.(2022).AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics.ACS Applied Materials & Interfaces.
MLA
Wang, Qiaoli,et al."AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics".ACS Applied Materials & Interfaces (2022).
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