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题名

TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs

作者
通讯作者Chen,Quan
发表日期
2023-05
DOI
发表期刊
ISSN
0278-0070
EISSN
1937-4151
卷号PP期号:99页码:1-1
摘要

Being a promising candidate for future non-volatile memory and neuromorphic computing, Spin-Transfer-Torque Magnetic Tunnel Junction (STT-MTJ) devices are gaining substantial momentum in industrial adoption in recent years, calling for EDA support for higher modeling capabilities. However, the complex interplay of multiple physical mechanisms featured in MTJ devices impose substantial challenges to their numerical modeling. In this work, we propose a fully coupled, transient electronic-magnetic-thermal (TEMT) modelling approach for STT-MTJ devices. Aiming to be first-principle and physically holistic, TEMT combines the atomistic non-equilibrium Green’s function (NEGF) model for tunneling currents, the Landau-Lifshitz-Gilbert-Slonczewski (LLGS) equation for magnetic dynamics and the heat conduction equation (HCE) for thermal dynamics in a self-consistent manner. To alleviate computational burden, we also devise an analytical approximation approach to reduce the number of NEGF solutions in the TEMT framework, which leads to over 15X speed-up with a very mild accuracy loss. An in-depth investigation of STT-MTJ devices using the TEMT framework is conducted to demonstrate its benefits and performance.

关键词
相关链接[Scopus记录]
收录类别
SCI ; EI
语种
英语
学校署名
第一 ; 通讯
EI入藏号
20223812754984
EI主题词
Circuit Simulation ; Digital Storage ; Frequency Modulation ; Heat Conduction ; Magnetic Anisotropy ; Magnetic Devices ; Timing Circuits ; Tunnel Junctions
EI分类号
Heat Transfer:641.2 ; Magnetism: Basic Concepts And Phenomena:701.2 ; Electric Network Analysis:703.1.1 ; Pulse Circuits:713.4 ; Data Storage, Equipment And Techniques:722.1 ; Mathematics:921 ; Physical Properties Of Gases, Liquids And Solids:931.2
ESI学科分类
ENGINEERING
Scopus记录号
2-s2.0-85137887939
来源库
Scopus
全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9877863
引用统计
被引频次[WOS]:0
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/402406
专题工学院_深港微电子学院
作者单位
School of Microelectronics, Southern University of Science and Technology, Shenzhen, China
第一作者单位深港微电子学院
通讯作者单位深港微电子学院
第一作者的第一单位深港微电子学院
推荐引用方式
GB/T 7714
Liu,Dawei,Chen,Quan. TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs[J]. IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS,2023,PP(99):1-1.
APA
Liu,Dawei,&Chen,Quan.(2023).TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs.IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS,PP(99),1-1.
MLA
Liu,Dawei,et al."TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs".IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS PP.99(2023):1-1.
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