题名 | TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs |
作者 | |
通讯作者 | Chen,Quan |
发表日期 | 2023-05
|
DOI | |
发表期刊 | |
ISSN | 0278-0070
|
EISSN | 1937-4151
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卷号 | PP期号:99页码:1-1 |
摘要 | Being a promising candidate for future non-volatile memory and neuromorphic computing, Spin-Transfer-Torque Magnetic Tunnel Junction (STT-MTJ) devices are gaining substantial momentum in industrial adoption in recent years, calling for EDA support for higher modeling capabilities. However, the complex interplay of multiple physical mechanisms featured in MTJ devices impose substantial challenges to their numerical modeling. In this work, we propose a fully coupled, transient electronic-magnetic-thermal (TEMT) modelling approach for STT-MTJ devices. Aiming to be first-principle and physically holistic, TEMT combines the atomistic non-equilibrium Green’s function (NEGF) model for tunneling currents, the Landau-Lifshitz-Gilbert-Slonczewski (LLGS) equation for magnetic dynamics and the heat conduction equation (HCE) for thermal dynamics in a self-consistent manner. To alleviate computational burden, we also devise an analytical approximation approach to reduce the number of NEGF solutions in the TEMT framework, which leads to over 15X speed-up with a very mild accuracy loss. An in-depth investigation of STT-MTJ devices using the TEMT framework is conducted to demonstrate its benefits and performance. |
关键词 | |
相关链接 | [Scopus记录] |
收录类别 | |
语种 | 英语
|
学校署名 | 第一
; 通讯
|
EI入藏号 | 20223812754984
|
EI主题词 | Circuit Simulation
; Digital Storage
; Frequency Modulation
; Heat Conduction
; Magnetic Anisotropy
; Magnetic Devices
; Timing Circuits
; Tunnel Junctions
|
EI分类号 | Heat Transfer:641.2
; Magnetism: Basic Concepts And Phenomena:701.2
; Electric Network Analysis:703.1.1
; Pulse Circuits:713.4
; Data Storage, Equipment And Techniques:722.1
; Mathematics:921
; Physical Properties Of Gases, Liquids And Solids:931.2
|
ESI学科分类 | ENGINEERING
|
Scopus记录号 | 2-s2.0-85137887939
|
来源库 | Scopus
|
全文链接 | https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9877863 |
引用统计 |
被引频次[WOS]:0
|
成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/402406 |
专题 | 工学院_深港微电子学院 |
作者单位 | School of Microelectronics, Southern University of Science and Technology, Shenzhen, China |
第一作者单位 | 深港微电子学院 |
通讯作者单位 | 深港微电子学院 |
第一作者的第一单位 | 深港微电子学院 |
推荐引用方式 GB/T 7714 |
Liu,Dawei,Chen,Quan. TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs[J]. IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS,2023,PP(99):1-1.
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APA |
Liu,Dawei,&Chen,Quan.(2023).TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs.IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS,PP(99),1-1.
|
MLA |
Liu,Dawei,et al."TEMT: A Transient Electronic-Magnetic-Thermal Coupled Simulation Framework for STT-MTJs".IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS PP.99(2023):1-1.
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条目包含的文件 | 条目无相关文件。 |
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