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题名

An Ultrasound Imaging System With On-Chip Per-Voxel RX Beamfocusing for Real-Time Drone Applications

作者
通讯作者Yoo, Jerald
发表日期
2022-09-01
DOI
发表期刊
ISSN
0018-9200
EISSN
1558-173X
卷号57期号:11页码:3186-3199
摘要
["For drone vision and navigation,For drone vision and navigation, low-power 3-D depth sensing with robust operations against strong/weak light and various weather conditions is crucial. CMOS image sensor (CIS) and light detection and ranging (LiDAR) can provide high-fidelity imaging. However, CIS lacks depth sensing and has difficulty in low light conditions. LiDAR is expensive with issues of dealing with strong direct interference sources. Ultrasound imaging system (UIS), on the other hand, is robust in various weather and light conditions and is cost-effective. However, in air channel, it often suffers from long image reconstruction latency and low framerate. To address these issues, we present a UIS application-specific integrated circuit (ASIC) that adopts the one-shot transmitter (TX) and on-chip per-voxel receiver (RX) beamfocusing (PV-RXBF) image reconstruction scheme. The ASIC adopts the designs of fully differential charge-reuse high-voltage TX (FDCR-HVTX), digital back-end (DBE), and an on-chip power management unit (PMU). FDCR-HVTX generates 28 V-pp pulses and reduces the average power consumption by 25% by charge reuse (CR). The DBE achieves 7.76-mu s processing latency and 9.83M-FocalPoint/s throughput to effectively translate real-time 3-D image streaming at 24 frames/s. A prototype UIS, with an 8 x 8 bulk piezo transducer array, is assembled with the proposed ASIC and a wireless data transmission module [field-programmable gate array (FPGA) + ESP32] on an entry-level consumer drone, and the real-time wireless 3-D image streaming at 24 frames/s with a range of 7 m is verified while the drone is flying.","The ASIC implemented in 180-nm 1P6M Standard CMOS occupies 32.5 mm(2) and consumes 142.3 mW."]
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语种
英语
学校署名
其他
资助项目
Agency for Science, Technology and Research (A*STAR) Advance Manufacturing and Engineering (AME) Wavefront Computing Program[A18A4b0055] ; Samsung Electronics[A-0005134-03-00]
WOS研究方向
Engineering
WOS类目
Engineering, Electrical & Electronic
WOS记录号
WOS:000862338600001
出版者
ESI学科分类
ENGINEERING
来源库
Web of Science
全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9903852
引用统计
被引频次[WOS]:6
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/406018
专题工学院_深港微电子学院
作者单位
1.Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117583, Singapore
2.Univ Calif Berkeley, Dept Mech Engn, Berkeley, CA 94720 USA
3.Southern Univ Sci & Technol SUSTech, Sch Microelect, Shenzhen 518000, Guangdong, Peoples R China
4.1 Inst Hlth, Singapore 117456, Singapore
推荐引用方式
GB/T 7714
Wu, Liuhao,Guo, Jiaqi,Jiang, Rucheng,et al. An Ultrasound Imaging System With On-Chip Per-Voxel RX Beamfocusing for Real-Time Drone Applications[J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS,2022,57(11):3186-3199.
APA
Wu, Liuhao.,Guo, Jiaqi.,Jiang, Rucheng.,Peng, Yande.,Wu, Han.,...&Yoo, Jerald.(2022).An Ultrasound Imaging System With On-Chip Per-Voxel RX Beamfocusing for Real-Time Drone Applications.IEEE JOURNAL OF SOLID-STATE CIRCUITS,57(11),3186-3199.
MLA
Wu, Liuhao,et al."An Ultrasound Imaging System With On-Chip Per-Voxel RX Beamfocusing for Real-Time Drone Applications".IEEE JOURNAL OF SOLID-STATE CIRCUITS 57.11(2022):3186-3199.
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